BIS Infotech

03/06/2026

AI is emerging as a critical enabler of real-time decision-making, advanced driver assistance, and autonomous driving. From dedicated AI accelerators and memory-efficient architectures to software-hardware co-design, automotive chipmakers are redefining performance within strict power and thermal limits. Discover how next-generation semiconductor innovations are overcoming the challenges of automotive edge computing and paving the way for safer, smarter, and more efficient mobility solutions.

Explore semiconductor optimization for Edge AI enabling low-power, high-performance automotive intelligence, safety, and autonomy.

03/06/2026

TDK Corporation presents the B25696H series of MKP DC high-frequency (HF) film capacitors, a reliable, high-performance DC link capacitor platform for next-generation SiC-based power electronics. With capacitance values from 47 µF to 1280 µF and rated DC voltages from 900 V to 2000 V, the components provide ultra-low self-inductance and low ESR to meet the demands of modern high-switching-frequency topologies. Typical applications for the B25696H are energy storage systems (ESS), solid-state transformers (SST), renewable energy inverters, traction drives, and industrial motor drives.

voltages

TDK introduces high-performance DC link capacitors designed for next-generation silicon carbide power electronics applications.

03/06/2026

MediaTek announced a groundbreaking achievement in partnership with Samsung, successfully completing the industry’s first test of a 3Tx 5-layer uplink configuration. Harnessing MediaTek’s M90 5G modem platform and Samsung’s advanced network technology, including its virtualized RAN (vRAN), Massive-MIMO radios (MMU) and Macro radios, this joint demonstration establishes a new standard in 5G uplink performance.

03/06/2026

At Computex 2026, Cadence announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack AI Super-Agent to Level 5 autonomy. Built on Cadence’s AI-driven electronic design automation (EDA) portfolio with NVIDIA Nemotron models, and secured by NVIDIA OpenShell runtime, the new agentic capabilities enable customers to run dynamic simulations in automated workflows. At NVIDIA, 1000s of engineers are using billions of compute hours per year to run millions of tests to verify their designs. Each engineer will use ChipStack agents to run hundreds of dynamic simulations with Cadence® Xcelium™ Logic Simulation and Jasper Formal Verification, delivering over 40X faster RTL validation cycles and reducing a typical five-week verification loop to less than a day, dramatically accelerating the validation of complex semiconductor designs.

Cadence’s AI-powered ChipStack agent accelerates semiconductor verification, reducing validation cycles from weeks to hours.

03/06/2026

Infineon Technologies AG is expanding its CoolSiC JFET portfolio in response to growing demand from AI data centers and the shift towards solid-state power protection. With new devices, package options and configurations, the company aims to support high-performance power distribution and protection systems. The first 750 V and 1200 V CoolSiC™ JFET devices in Q-DPAK packages, introduced last year, are now entering mass production. At PCIM Europe 2026, Infineon will present additional package options and normally-off variants, further strengthening its discrete portfolio for applications such as solid-state circuit breakers (SSCBs), battery disconnect switches and power distribution architectures in AI data centers, including power supply units (PSUs), power backup units (PBUs) and intermediate bus converter (IBC) hot-swap and eFuse designs.

Infineon broadens CoolSiC JFET portfolio with new variants for AI data center power protection and distribution.

03/06/2026

ROHM Co., Ltd. has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) for AI server power supplies. With the rise of generative AI, AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC (high-voltage direct current) architectures. In this environment, ROHM’s device was selected as a SiC power device that supports next-generation power supply systems.

ROHM’s 750V SiC MOSFET enables efficient battery backup units for emerging high-voltage AI server architectures.

03/06/2026

As AI workloads continue to scale, data center architects are increasingly constrained by limited signal reach and rising latency, which can leave valuable memory resources underutilized across large GPU clusters. These challenges are amplified as interconnect speeds increase. At 64 GT/s (giga transfers per second), signal integrity limitations can restrict system scale and burden server architectures. In response, Microchip Technology has released XpressConnect PCIe 6.0 and CXL 3.1 retimers to enable memory expansion and resource disaggregation in large-scale AI fabrics.

Microchip Technology has released XpressConnect PCIe 6.0 and CXL 3.1 retimers to enable memory expansion and resource disaggregation.

03/06/2026

One of the major steps undertaken by the President of Myanmar, Min Aung Hlaing, in diplomacy, which would enhance the stability of the region, as well as promote cooperation between the two countries, is the pledge he made to India that Myanmar will not use its national territory for conducting any operations that might endanger India’s national security. This was a very crucial matter because this was the main point around which the numerous negotiations between the President of Myanmar and the Prime Minister of India, Narendra Modi, took place in New Delhi.

Myanmar pledges its territory will not be used for activities threatening India’s security, strengthening bilateral cooperation.

03/06/2026

Pickering Interfaces will showcase its broad portfolio of modular signal switching and sensor simulation solutions for automotive and electric vehicle electronics test at The Battery Show Europe 2026, taking place 9-11 June 2026 at Messe Stuttgart in Germany. Visitors to Stand D81 in Hall 3 will see how Pickering’s PXI, LXI, and USB platforms support scalable test systems for applications such as EV battery management systems, ECU test, hardware-in-the-loop simulation, fault insertion, signal routing, and sensor simulation.

Pickering highlights scalable switching and sensor simulation platforms for EV battery, ECU, and hardware-in-the-loop testing.

03/06/2026

Infineon Technologies AG introduces a 24-kW battery backup unit (BBU) DC-DC reference design for high-voltage (HV) DC bus architectures in artificial intelligence (AI) data centers. The design is the first of its kind to operate directly from a battery stack to an 800 V DC bus, using 650 V and 1200 V silicon carbide (SiC) technology. It achieves a power density of 450 W/in³ and efficiency exceeding 99 percent within the same physical form factor as current low-voltage (LV) BBU implementations, addressing a key infrastructure bottleneck as data centers transition to higher-voltage DC distribution.

Infineon introduces a 24-kW battery backup unit (BBU) DC-DC reference design for high-voltage (HV) DC bus architectures.