02/06/2026
At ECTC 2026, our AT&S team brought microelectronics innovation to life💡
From advanced packaging and thermal management to hybrid bonding and panel-level packaging, this year’s discussions made one thing clear: IC substrates remain a key enabler of future AI technologies.
Innovation in AI is happening beyond the silicon, advanced packaging and interconnect technologies are critical for next-generation computing.
Organic IC substrates continue to play a central role, and glass cores will not replace them, but coexist as complementary technologies.
👉️Swipe to see the highlights.
Thank you to everyone who joined us at the booth and sessions.
Let’s keep driving the future of microelectronics together. 🤝