04/11/2026
**See What Lies Beneath the Surface!**
Hidden defects can affect the performance and reliability of semiconductor components.
SolidNDT's Scanning Acoustic Microscope (SAM) provides high-resolution, non-destructive imaging for internal defect detection and interface inspection.
Key capabilities include:
🔹 Reflection and transmission modes
🔹 High-resolution imaging (±2 μm)
🔹 Large-area scanning
🔹 Customizable inspection configurations
Applications:
✔ HBM wafer inspection
✔ Wafer bonding
✔ IC package delamination
✔ DBC ceramic substrates
✔ SiC and power semiconductor devices
Discover advanced acoustic imaging with SolidNDT.