Longsys

Longsys Established in 1999, Longsys (301308.SZ) is a branded semiconductor memory enterprise.

Longsys is engaged in the R&D, design, and sales of Flash memory and dynamic random access memory (DRAM). With its primary focus being on storage products and applications, the company has formed core competitiveness, such as firmware algorithm development, storage chip testing, integrated package design, and storage product customization. It provides consumer, industrial, and automotive storage p

roducts along with software and hardware application solutions for industrial storage. Longsys has formed four product lines: embedded storage, solid-state drive (SSD), mobile storage, and memory module, and also owns the industrial storage brand FORESEE and international high-end consumer storage brand Lexar. Longsys storage products are widely used in smartphones, smart TVs, tablets, computers, communication devices, wearable devices, Internet of Things (IoT), security monitoring, industrial control, automotive electronics, and personal mobile storage.

Celebrating our 27th Anniversary 🎂 Over 27 years, has rooted deeply in the storage industry with persistent dedication...
27/04/2026

Celebrating our 27th Anniversary 🎂
Over 27 years, has rooted deeply in the storage industry with persistent dedication.
Moving forward, we leverage innovation to unlock endless possibilities of the AI era.

22/04/2026

Introducing Longsys PCIe Gen5 mSSD-Next-Generation High-Speed Storage Media

Featuring a DRAM-less compact 20Ă—30mm M.2 2230 design, it offers excellent form-factor scalability and seamless integration without PCB layout redesign. Powered by the Maxio 1802 controller, it achieves 11GB/s read, 10GB/s write, high IOPS and up to 8TB capacity, catering to high-speed mass storage for AI PCs and edge AI applications.

Our proprietary VC phase-change thermal solution resolves Gen5 thermal throttling issues. Integrated with v***r chamber, graphene and composite thermal stacking, it maintains peak performance for 181s and delivers 2.5Ă— higher continuous read throughput than standard designs. Optimized for heavy AI PC KV Cache workloads, it perfectly balances Gen5 ultra-high speed, slim device size and steady edge AI operation.

13/03/2026

What an incredible week at

Nürnberg has been buzzing with the embedded community at Embedded World 2026 this week. A huge thank you to everyone who stopped by our booth—it was fantastic to catch up with partners and meet new faces from around the globe to discuss the future of embedded technology.

Check out our recap video to see the highlights! We're already looking forward to next year!

11/03/2026

We’re thrilled to showcase our AI Storage solutions for automotive, data center and embodied intelligence at Booth 1-112, Hall 1.

Great discussions and innovations happening here. Come and meet our team!

Live from in Nuremberg!We’re thrilled to showcase our AI Storage solutions for automotive, data center and embodied in...
11/03/2026

Live from in Nuremberg!
We’re thrilled to showcase our AI Storage solutions for automotive, data center and embodied intelligence at Booth 1-112, Hall 1.
Great discussions and innovations happening here. Come and meet our team!

09/03/2026

The countdown is on for Embedded World in Nuremberg, Germany! Check out the video to see what we will bring to this show! 👇
đź“Ť Booth 1-112, Hall 1
📅 March 10–12

AI Storage for Embedded World.
Stay tuned!

From Spain to Germany: Continues Its Global AI Storage Journey at 🚀Mark your calendars: Longsys will be at Embedded W...
04/03/2026

From Spain to Germany: Continues Its Global AI Storage Journey at 🚀

Mark your calendars: Longsys will be at Embedded World 2026 (March 10–12, Nuremberg, Germany) to present our next-gen AI storage solutions for automotive, industrial, and edge AI applications.

đź“Ť Find us at Booth 1-112, Hall 1 to explore how our storage technologies power the future of embedded systems.

Let’s connect in Nuremberg!

🚀 Live from Barcelona: Longsys is bringing its latest embedded storage innovations at MWC 2026, focusing on full-scenari...
03/03/2026

🚀 Live from Barcelona:
Longsys is bringing its latest embedded storage innovations at MWC 2026, focusing on full-scenario AI terminals.

On-site highlights you won’t want to miss:
âś… AI Mobile: Breakthrough HLC & pTLC technologies integrated in UFS devices, optimizing DRAM usage, BOM cost, and balancing capacity, performance and reliability, powered by our in-house WM series controllers.
âś… AI Wearable: Latest ePOP5x with ultra-thin 0.52mm packaging, doubled data rate and flexible configurations, empowering lightweight AI glasses and wearables.
âś… AI PC: High-speed storage medium mSSD and Lexar's industry-first AI Storage Core, along with AI-optimized Storage Stick & SSD, unlocking full performance for local AI models.

Come experience how Longsys is empowering the mobile world with embedded integrated storage innovation — we're here to connect, collaborate, and shape the next era of edge AI.

27/02/2026

Only 3 days to ! 🚀

Here’s a sneak peek of what is bringing to Barcelona:
âś… Storage solution for AI phones, AI wearables, AI PCs & embodied robots
✅ Brand-new AI mobile storage product — making its global debut!

Catch the first look at Hall 7, B27 (March 2–5, Barcelona) — where innovation meets the mobile world. See you there!

Through advanced storage technologies engineered for reliability, performance, and protection, we are committed to build...
30/11/2025

Through advanced storage technologies engineered for reliability, performance, and protection, we are committed to building a digital world that is safer, smarter, and more connected.


Following last month’s launch of the , Longsys has further expanded its potential—introducing an entirely new storage c...
27/11/2025

Following last month’s launch of the , Longsys has further expanded its potential—introducing an entirely new storage category under Lexar: the industry’s first AI Storage Core. 🙌

Built on the mSSD storage medium, this innovation combines customized hardware and firmware, strengthened reliability standards, and a hot-swappable design, bringing a next-generation storage approach to the edge AI era.

Three Core Innovations Built for the AI Era:
· High Performance for AI Acceleration
· High Reliability for Harsh Environments
· High Flexibility for Cross-Device AI Collaboration

Address

Floor 20, 22, 23, B Tower, Horoy Qianhai Finance Centre Phase II, No. 5059, Tinghai Avenue, Qianhai
Shenzhen
518057

Telephone

+8675586168848

Website

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