Socionext Europe

18/08/2026

Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology

Advanced SoC Developments Target AI, HPC, and Datacenter Applications with Intel's Performance-optimized 18A-P Technology

[Langen/Germany, Yokohama/Japan and Milpitas/California, August 18, 2026] --- Socionext Inc., a global leader in custom system-on-chip (SoC) design and advanced semiconductor solutions, announced that it will leverage Intel 18A-P process technology in the development of custom SoCs that meet the emerging needs of datacenter, edge, and high-performance computing customers. The first development is a high-performance compute chiplet.

By combining its ASIC expertise with Intel Foundry’s advanced process and packaging roadmap, Socionext will enable customers to create differentiated SoC solutions optimized for application-specific workloads.

"Intel 18A-P represents an important step in advanced process technology, combining innovations in transistor architecture and power delivery," said Rajinder Cheema, CTO and Executive Vice President at Socionext. "By developing SoC capabilities on this process, Socionext is enabling our customers to address the evolving performance and power requirements of AI, HPC, and advanced datacenter applications."

“The combination of Socionext’s Solution SoC development methodology and Intel Foundry's advanced process and packaging technologies enriches the ecosystem for enabling product development for AI acceleration, high-performance compute, and Physical AI,” said John Zucker, General Manager and Vice President of Global Business Development and Marketing, Intel Foundry. “Together we accelerate our customers' time-to-market from architecture to production.”

Socionext's planned use of Intel’s technologies reinforces its commitment to working closely with leading foundry partners to deliver custom silicon and packaging for high-performance SoC solutions in focus markets.

Read full release here: https://www.eu.socionext.com/nextnews/socionext-broadens-soc-roadmap-with-intel-18a-p-process-technology.html

04/08/2026

Socionext Joins imec’s Autonomous Edge Chiplet Program (AECP)

[Langen/Germany, Yokohama/Japan, August 3, 2026] --- Socionext Inc. today announced that it has joined the Autonomous Edge Chiplet Program (AECP), an initiative led by imec, the world-leading research and innovation center for advanced semiconductor technologies. Through its participation in imec’s core partner program, Socionext has been advancing research activities in leading-edge logic semiconductor technologies and 2.5D/3D/5.5D packaging technologies. By joining AECP, Socionext will further strengthen its efforts toward the practical adoption of chiplet technology in the autonomous field and contribute to the delivery of high-performance, high-quality leading-edge SoCs.

In the automotive industry specifically, demand for in-vehicle computing performance is rapidly increasing amid the advancement of software-defined vehicle (SDV), advanced driver-assistance systems (ADAS), and autonomous driving (AD). To meet these requirements, semiconductors are expected to deliver higher functionality and larger-scale integration. Chiplet technology, which integrates multiple function-specific chips using advanced packaging technologies, is gaining attention as a next-generation semiconductor architecture that can improve performance, enable flexible functional expansion, and enhance development efficiency. At the same time, addressing the increasing complexity of large-scale designs, maintaining high design quality, and ensuring product quality in mass production remain key challenges.

Originally launched as the “Automotive Chiplet Program”, imec has expanded its chiplet technologies and architectures developments into the Autonomous Edge Chiplet Program (AECP), broadening the focus on applications beyond automotive systems to areas such as robotics and aerospace. Imec’s AECP is a collaborative research program involving automakers, robotics companies, semiconductor companies, EDA vendors, and other industry participants. The program promotes the verification of chiplet architectures and advanced packaging technologies that meet autonomous system requirements for performance, functional safety, reliability, and long-term supply. It also aims to accelerate the widespread adoption and practical implementation of chiplet technology through standardization and the establishment of reference designs. Through its participation in AECP, Socionext will further enhance its next-generation chiplet technology platform while preparing for the evolving opportunities enabled by autonomous edge and chiplet-based computing.

Read full release here: https://www.eu.socionext.com/nextnews/socionext-joins-imec%E2%80%99s-autonomous-edge-chiplet-program-(aecp).html

02/07/2026

Socionext Addresses Datacenter Infrastructure Customer Demands for Advanced SoCs on TSMC A14 Technology

Langen/Germany, Yokohama/Japan and Milpitas/California, July 1, 2026 --- Socionext Inc., a global leading provider of advanced custom SoCs to the fastest growing segment of the semiconductor market, AI datacenter infrastructure, is announcing the development of a high-performance compute chiplet in TSMC’s A14 process technology.

As part of this initiative, Socionext plans to tape out a multi-core device in September 2026.
This chip will serve as a technology platform to validate CPU and xPU architectures for scalability, on leading-edge process technology, supporting customer programs in AI hyperscale datacenters and other high-performance, compute-intensive applications.

The planned device will integrate compute chiplets designed for high-performance, power efficiency, and system scalability. Learnings from this program are targeted at accelerating the development of production SoCs tailored to AI/xPU infrastructure applications.

Socionext’s engagement with TSMC builds on the company’s long-standing expertise in leading-edge silicon design, encompassing multi-core CPU and xPU architectures in advanced process technologies for complex SoCs targeting enterprise and data center applications.

“Driven by increasing AI data center demands, this engagement highlights the strategic importance of advanced compute platforms and our commitment to working closely with customers and ecosystem partners,” said Hisato Yoshida, President and COO of Socionext. “By collaborating with TSMC on A14 technology, we are de-risking leading-edge product developments and accelerating time-to-market for differentiated, high-performance custom silicon solutions.”

Socionext is actively engaging with customers planning to adopt TSMC’s A14 process to develop high-performance and power-efficient AI SoCs targeting the data center infrastructure buildout. These engagements exemplify Socionext’s ongoing commitment to leading-edge technologies such as A14 to enable flawless ex*****on for our customers and provide them with the fastest time-to-market for the most advanced products.

Socionext continues its strategic investments for AI data center platforms through advanced SoC technologies to support the industry’s insatiable demand for high compute density, energy efficiency, and system-level performance.

Read full release here: https://www.eu.socionext.com/nextnews/socionext-addresses-datacenter-infrastructure-customer-demands-for-advanced-socs-on-tsmc-a14-technology.html

[Langen/Germany, Yokohama/Japan and Milpitas/California, July 1, 2026] --- Socionext Inc., a global leading provider of advanced custom SoCs to the fastest…

15/06/2026

Securing the Automotive Display Pipeline

Automotive displays are evolving rapidly. Larger screens, higher resolutions and more centralised cockpit architectures are creating new demands on the display and signal processing chain.

The key question: How can this increasingly complex display path remain safe, secure and resilient?

In this new 30-minute technical presentation Mark Müller, Senior Marketing Manager Automotive, Socionext Europe explores the role of Graphic Display Controller (GDC) architectures in modern cockpit systems, covering functional safety, protection against manipulation and secure video signal processing.

Watch the presentation on YouTube:
https://lnkd.in/e2rE-GYJ

10/06/2026

In this expert panel, Gil Golov, Senior Director Solution SoC Marketing, Socionext Europe, VW, Forvia and Volvo take a clear look at what this really means for next-gen vehicle design.

From zonal architectures and centralized compute to AI, safety and semiconductors, the discussion goes straight into the core of how future E/E systems will be built.

Clear perspectives on what needs to change and what will define the next generation of automotive platforms.

Watch the full session on the future of E/E architecture in the software-defined vehicle here:
https://youtu.be/QiLHGdLxhNQ

05/05/2026

VECS 2026 doors are open. Socionext Europe is there – Booth C04:32
Gothenburg May 5-6

Explore what’s next in automotive compute and custom silicon
The future of safer mobility depends on much more than compute performance alone. It needs scalable platforms, validated software environments and close collaboration across the automotive ecosystem.

Here’s what awaits you:

> Solution SoC - including the use of chiplets for the scalable and efficient implementation of automotive zonal architectures, together with our Flexlet™ approach that sets a new standard for chiplet-based SoC design

> A complete autonomous driving real time closed loop neural simulation with aiMotive, a Socionext ecosystem partner, bringing together aiDrive, aiSim, aiData and aiWare on an optimised SoC

> A next generation automotive storage and connectivity platform combining:
– SANDISK® AT EN610 NVMe™ SSD
– Socionext SC1900 PCIe® switch

> Smart Display Controllers for safe and secure remote display management with image enhancement, local dimming and warping

> 60GHz Radar Sensor for interior cockpit presence detection, gesture control and reliable external tailgate control

See full events details here: https://www.eu.socionext.com/company/nextevents.html

09/04/2026

Custom silicon. Automotive compute. See it live at VECS 2026

Meet Socionext Europe in Gothenburg, May 5–6 | Booth C04:32
Solution SoC and chiplet architectures, real‑time autonomous driving simulation with aiMotive, next‑gen automotive storage and connectivity, smart display controllers, and 60 GHz radar sensing.

20% off with code SocionextDiscount.

More details here: https://www.eu.socionext.com/nextnews/custom-soc-innovation-live-at-vecs.html

Also catch Stewart Bell talk on 6 May (10:05–10:30), Track B: “Use of Chiplets for Scalable Automotive Compute Applications”.

Custom SoC. From Concept to Solution – Optimized for You