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T-Global Technology Europe and North America Ltd

Name: T-Global Technology Europe and North America Ltd
Address: Lutterworth, GB
Telephone: +441455553510

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T-Global Technology Europe and North America Ltd

T-Global Technology is a leading supplier of advanced thermal management solutions. We offer design support, rapid sampling and full engineering support.

Local Business

04/08/2026

What is ASTM E595?

ASTM E595 is the internationally recognised test method used to determine the outgassing characteristics of materials exposed to high vacuum environments.

ASTM E595 was developed in response to the need to control molecular contamination on spacecraft. During the 1970s, NASA increasingly recognised that spacecraft and satellites had to be designed with outgassing risks in mind, particularly for materials used in high-vacuum environments where even trace contamination could compromise performance.

The standard established a consistent method for evaluating the outgassing characteristics of materials, helping determine whether they were suitable for use in contamination-sensitive applications.

The procedure measures:

- Total Mass Loss (TML)
- Collected Volatile Condensable Material (CVCM)
- Water Vapour Regained (WVR)

These measurements allow engineers to compare materials based on their tendency to release volatile compounds under vacuum conditions.

Find out more about the standard and our low outgassing thermal pads here: https://www.tglobaltechnology.com/2026/07/29/what-is-astm-e595/

30/07/2026

Our latest newsletter has just landed!

If you're involved in thermal management or electronic design, this edition is full of practical insights, industry updates and technical guidance to help you to stay ahead.

This issue includes:

- Our latest product launch for our highest thermally conductive adhesive tape to date

- How effective thermal management is supporting the next generation of server applications

- An introduction to ASTM E595 and why it's relevant far beyond the aerospace industry

- A straightforward guide to thickness and dimensional tolerances to help you select the right thermal solution for your next design

Read the latest issue online here: https://email.tglobaltechnology.com/t-global-technologys-newsletter-7 or subscribe to receive future editions straight to your inbox via: https://www.tglobaltechnology.com/newsletter-sign-up/

23/07/2026

Introducing TG-T1002 Thermal Tape: T-Global Technology’s highest thermal conductivity adhesive tape.

Designed to support efficient heat transfer and secure components without mechanical fasteners, TG-T1002 delivers 2.1 W/mK thermal conductivity alongside low thermal impedance of 0.84 °C·in²/W at 30 psi, helping engineers improve cooling performance in demanding electronic applications.

With strong adhesion, long-term reliability, and custom die-cut options available, TG-T1002 is ideal for applications including LED modules, display panels, power supplies, IC chips, MOSFETs, routers, network equipment, and heat sink assemblies.

Find out more about TG-T1002 and explore how T-Global Technology can support your next thermal management challenge via https://www.tglobaltechnology.com/2026/07/22/tg-t1002-thermal-tape-launched/

02/07/2026

Our latest newsletter has just landed!

If you're working in thermal management or electronic design, this edition is packed with practical insights to help you stay ahead.

Inside you'll find:

- An introduction to our new ASTM E595-certified TG-AD30D thermal pad
- Key industry applications for display panels
- An important NRND update for one of our thermal tapes
- A simple thermal pad selection guide to help you choose the right solution for your next project

Read the latest issue online here: https://bit.ly/4wHg64z or subscribe to receive future editions direct to your inbox via https://bit.ly/4eWPcOP

26/06/2026

As Europe experiences another record-breaking heatwave, it's a reminder that heat isn't just a challenge for people, it's one of the biggest issues facing modern electronics.

From AI servers and EV power electronics to industrial automation and telecommunications, higher operating temperatures can reduce performance, shorten component lifespan and impact long-term reliability.

With ambient temperatures rising, effective thermal management becomes even more critical. Recent heat records across the UK and Europe have highlighted how extreme temperatures are increasingly affecting infrastructure and technology alike.

That's where thermal interface materials (TIMs) play a vital role.

By efficiently transferring heat away from critical components, high-performance TIMs and next-gen thermal management solutions help engineers maintain system reliability, improve efficiency and support longer product lifecycles, even in demanding environments.

At T-Global Technology, we work with customers across a range of industries to solve complex thermal challenges through a comprehensive range of thermal management solutions, including thermal pads and putties, phase change materials, v***r chambers, heat spreaders and more.

Find out more about our full product range here: https://www.tglobaltechnology.com/products/product-categories/

08/06/2026

Introducing TG-AD30D Low Outgassing Thermal Pad:

T-Global Technology is pleased to announce the launch of the new TG-AD30D, an advanced low-outgassing thermal pad designed for applications where thermal performance, reliability, and material stability are critical.

Engineered to ASTM E595 standards for demanding applications across aerospace, AI infrastructure, datacom, automotive electronics, energy storage, military systems, and advanced industrial equipment, TG-AD30D helps manufacturers address thermal challenges without compromising long-term system reliability.

With a thermal conductivity of 3.0 W/mK, low thermal impedance and excellent electrical insulation properties, TG-AD30D is optimised for high-power applications requiring efficient heat transfer and dependable mechanical compliance with minimal outgassing.

TG-AD30D extends our hybrid thermal pad portfolio with a material specifically developed for applications where outgassing performance is a major design consideration, this product enables customers to achieve reliable thermal management in increasingly sensitive and high-performance electronic systems.

Find out more: https://www.tglobaltechnology.com/2026/06/03/low-outgassing-thermal-pad-launched/

29/05/2026

Our latest newsletter has just landed!

Highlights include details on our latest product launch for our best in class reinforced thermal pad TG-A9000F, details on how to access our thermal simulation service, the last chance to secure your free tickets to Hardware Pioneers Max, and a showreel for our TG-AD hybrid thermal pad series.

To view the latest issue or sign up for future editions check out the links below:

View the latest edition here: https://email.tglobaltechnology.com/t-global-technologys-newsletter-5

Sign up here: https://www.tglobaltechnology.com/newsletter-sign-up/

19/05/2026

We’re pleased to announce the launch of TG-A9000F Reinforced Thermal Pad, our best in class reinforced thermal pad designed for demanding, high-power applications.

With 7.0 W/mK thermal conductivity, a single-sided fibreglass reinforced design, low thermal impedance and strong tear resistance, TG-A9000F Reinforced Thermal Pad offers a reliable option for applications such as servers, data centres, and PSUs.

Its combination of compressibility, electrical isolation, and dimensional stability helps support easier processing and dependable long-term thermal performance in challenging environments.

Find out more: https://bit.ly/4fv9K2D

30/04/2026

Our latest newsletter has just landed!

Highlights include details on an exciting new partnership with a leading European fabless designer, how to secure yourself a free ticket to the UK's largest show for electronics, our supply chain resilience and a showreel for our high elasticity thermal gel series.

Latest issue: https://email.tglobaltechnology.com/t-global-technologys-newsletter-4

Subscribe: https://www.tglobaltechnology.com/newsletter-sign-up/

23/04/2026

T-Global Technology Europe and North America will be exhibiting at Hardware Pioneers Max 2026: 10-11 June, ExCel London.

We're delighted to announce that T-Global Technology will be exhibiting at Hardware Pioneers Max 2026, the UK’s largest exhibition and conference for cutting-edge electronics, engineering innovation, and hardware development.

T-Global Technology will be located at Stand C10 where visitors can speak directly with our team about their heat dissipation challenges, product design requirements, and performance optimisation needs.

The team will provide guidance on selecting the most suitable thermal interface materials for a wide range of applications, including consumer electronics, automotive systems, industrial equipment, and telecommunications.

To find out more, including a chance to bag yourself a free ticket to show on us visit: https://www.tglobaltechnology.com/2026/04/23/come-and-see-us-at-hardware-pioneers-max-2026/

Address

Lutterworth

Opening Hours

Monday	9am - 5pm
Tuesday	9am - 5pm
Wednesday	9am - 5pm
Thursday	9am - 5pm
Friday	9am - 5pm

Telephone

+441455553510

Website

http://www.tglobaltechnology.com/

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