Global Electronics Association

06/17/2026

06/16/2026

Congratulations to Dr. Devan Iyer, our chief strategist for advanced electronic packaging, on his appointment to ASMPT Ltd's newly formed Advanced Packaging Technology Advisory Council (TAC).

The TAC serves as an independent advisory body that provides recommendations and perspectives to ASMPT's management on key focus areas, bringing together leaders with deep expertise across AP technology development, assembly and test, manufacturing operations and quality, and academic research.

Dr. Iyer joins a distinguished group of industry leaders shaping the semiconductor industry's future. His fellow council members are:

• Dr. Gaurang Choksi — Former Vice President, Technology Development, Intel Corporation (Chair)
• Dr. babak sabi — Former Vice President, Annapurna Lab, AWS; Former Intel Senior Vice President, Assembly & Test Technology Development
• Mr. Vincent Tong— Head of Global Operations & Quality, Altera; former EVP of Global Operations at Xilinx and former Chief Quality Officer at AMD
• Dr. Jae-Inh Song — Professor, Hanyang University‑ERICA; Former ASM executive (VP Global Business Operations & New Business Development)

Our sincere congratulations on this well-deserved recognition of Dr. Iyer’s leadership and expertise in advanced electronic packaging.

Learn more: https://shorturl.at/AXqIz

06/15/2026

We’re excited to announce the release of Fundamentals and Best Practices for E-Textile System Development, a new Technology Solutions Next-Generation Guideline from the Global Electronics Association.

Developed with input from industry experts across the e-textiles ecosystem, this guideline provides a structured, high-level framework to help organizations navigate the complexities of e-textile system development, from materials and integration approaches to testing, reliability, and manufacturing considerations.

Explore the new guideline and hear directly from the experts who are behind it: https://www.electronics.org/next-generation-guideline-fundamentals-and-best-practices-e-textile-system-development

06/12/2026

Call for Participation is OPEN!

Submissions are now being accepted for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration, taking place at 2027, April 5-8 in Anaheim, California.

AEPC brings together engineers, researchers, manufacturers, and technology leaders to share peer-reviewed research, practical solutions, and emerging technologies shaping the future of electronics.

We are seeking:

✅ Technical Presentations
✅ Technical Posters
✅ Professional Development Courses

Deadlines are:

Technical Presentations – abstracts due September 18, 2026
Professional Development Courses – proposals due September 18, 2026
Technical Posters – abstracts due December 4, 2026

Your presentation will reach a highly engaged global audience looking for new technologies, manufacturing solutions, and practical insights they can apply within their companies and across the electronics value chain.

View submission requirements here: https://hubs.li/Q04lch5F0

06/11/2026

The World Cup draws fans from every corner of the world. Turns out, so do our members.

We represent companies across North America, Europe, Asia, and beyond, which means our meetings are about to get a little more competitive. Friendly competition, of course. Mostly.

The electronics in a single broadcast might include chips designed in one country, fabricated in another, assembled in a third, and displayed on a screen made in a fourth. Global collaboration is kind of our thing, too.

Whoever wins the Cup, we'll all be watching together.

06/10/2026

Have you registered for IPC Builds 2026?

Join us for a week-long series of IPC standards development committee meetings in Paris, France, from September 19 to 24, 2026.

IPC Builds brings together electronics industry experts from around the globe to collaborate on essential industry documents covering topics such as materials, PCB fabrication, assembly, design, Factory of the Future technologies, E-Textiles, and training.

Whether you are a longstanding committee participant or new to IPC standards development, we welcome your expertise and participation.

📍 H4 Hotel Wyndham Paris Pleyel Resort, Saint-Denis, France
📅 19–24 September 2026

Register now and help shape the future of electronics manufacturing:
IPC Builds-Standards Development Committee Meetings | https://hubs.li/Q04kM3jd0 (https://hubs.li/Q04kYcBM0)

06/09/2026

Last week, the European Commission released the Chips Act 2.0 as part of the European Technological Sovereignty Package, representing real progress for our industry.

The proposal extends support beyond semiconductors to PCBs, PCBAs, IC substrates, and advanced packaging -- exactly the kind of comprehensive, silicon-to-systems approach we have been advocating for on the continent for years, in the lead-up to this landmark legislation.

There is still work ahead: the policy framework now needs to be implemented effectively across member states, and success will ultimately be measured by the investment it catalyzes throughout the electronics ecosystem.

The Global Electronics Association will remain actively engaged with EU institutions, member states, and members of Parliament to see that through.

Full statement: https://hubs.li/Q04kMFPr0

06/09/2026

Congratulations to Elcira DeLeon from E-Tron Systems, who won first place in the inaugural wiring harness competition in the United States. Next stop: Munich in November, when she competes in the world championship at electronica.

Learn how Elcira met the challenge of completing the assembly within one hour, and how she is prepping for Munich here: https://hubs.li/Q04kJMrb0

06/08/2026

Recent computer science graduates may overlook job opportunities in the electronics manufacturing industry, which needs tech talent to upgrade legacy systems.

This sector builds devices essential for health care,
transportation, energy, and defense, contributing about $853 billion to the United States GDP and supporting nearly five million jobs.

Currently, there's a significant talent gap that CS graduates can fill. David Hernandez, VP of education, highlights the benefits of pursuing manufacturing jobs and offers advice in a recent Built In article.

With the software industry saturated, new computer science graduates can find lots of high-paying jobs in computer hardware.