The Test Connection, Inc.

08/21/2026

Wire bonding remains an essential process in semiconductor packaging, but there is no single wire material that is ideal for every application. Gold (Au) offers excellent reliability, while copper (Cu) provides high conductivity at a lower cost. Palladium-coated copper improves surface stability, aluminum (Al) is commonly used for wedge bonding, and silver or silver-alloy wires support specialized applications requiring high conductivity.

Selecting the correct bonding wire requires balancing bondability, electrical conductivity, reliability, process compatibility, and cost. The final choice also depends on the device type, including integrated circuit packages, power devices, advanced packaging, and specialty components.

Why is this important for production testing? Wire-bond problems can create opens, intermittent connections, increased resistance, leakage, and performance failures that may not be visible during standard inspection. Understanding the wire material and bonding process helps test engineers establish appropriate electrical limits, stress conditions, and test coverage. In-circuit, functional, flying-probe, and semiconductor testing can help detect failures caused by damaged, lifted, weak, or improperly bonded wires before the product reaches the customer. Combining electrical testing with X-ray, computed tomography, and other inspection methods provides a stronger approach to identifying internal packaging defects and improving overall product reliability.

07/04/2026

06/13/2026

Hidden Defects Can’t Be Fixed If You Can’t See Them

Many PCB and PCBA defects occur beneath components, inside vias, or within solder joints where traditional visual inspection simply cannot reach. This is where X-Ray and Computed Tomography (CT) inspection become valuable tools for manufacturers.

X-Ray inspection provides a non-destructive method to evaluate hidden features such as:

✔ BGA solder joint quality
✔ Voids in solder connections
✔ Head-in-pillow defects
✔ Insufficient or excessive solder
✔ Hidden solder bridges
✔ Through-hole barrel fill
✔ Press-fit connector integrity
✔ Internal PCB structural issues

For more advanced analysis, CT (Computed Tomography) creates a three-dimensional view of the assembly, allowing engineers to virtually slice through the product and inspect internal structures layer by layer. CT can help identify defects that may contribute to intermittent failures, reliability concerns, or field returns before products reach customers.

At The Test Connection, Inc. (TTCI), our X-Ray and CT inspection services support:
• Failure Analysis
• Process Validation
• First Article Inspection
• New Product Introduction (NPI)
• Manufacturing Process Improvement
• Supplier Quality Verification

The ability to see inside a product without destroying it can significantly reduce troubleshooting time, improve yields, and increase confidence in product quality.

Sometimes the most critical defect is the one hidden from view.

05/25/2026

The Test Connection Inc. (TTCI) is proud to work with SMH Technologies, a leader in in-system programming solutions.
SMH continues to advance production programming with tools like FlashRunner 2.0 and their new fr_comm Python library, which allows FlashRunner to be integrated directly into Python-based production and test environments. The library supports Python 3.10 or newer and gives users access to FlashRunner commands, file transfers, project ex*****on, encryption, and real-time logging from Python.
For TTCI, this is a powerful advantage when developing in-circuit test solutions and custom programming stations. Python integration allows us to build flexible automation around programming, test sequencing, data handling, and production reporting. It also helps support modern manufacturing environments where Windows, Linux, ARM Linux, LAN, USB/Serial, embedded controllers, and MES connectivity may all be part of the solution.
By combining TTCI’s experience in test engineering and production automation with SMH Technologies’ in-system programming platforms, we can deliver solutions that help customers program devices efficiently, capture results, reduce manual steps, and improve confidence on the production floor.
Whether we are integrating programming into an ICT fixture, building a standalone programming station, or supporting a custom automated test process, SMH Technologies gives TTCI the tools to create reliable, scalable, and production-ready solutions.
TTCI is excited to continue using industry-leading technology that helps our customers test, program, and ship with confidence.

05/25/2026

This is an outstanding introduction to X-ray inspection and Computed Tomography (CT) technology, especially for anyone involved in electronics manufacturing, quality assurance, reliability engineering, or failure analysis of circuit card assemblies.

Traditional 2D X-ray systems have long been used to inspect hidden solder joints, BGAs, BTCs, QFNs, vias, and internal PCB structures that cannot be seen with optical inspection. CT technology takes this capability to the next level by capturing hundreds or even thousands of X-ray images at different angles and reconstructing them into a fully navigable 3D model of the assembly.

What makes CT so powerful is the ability to virtually “slice” through the PCB or PCBA layer by layer without destroying the product. Engineers can inspect internal solder voiding, barrel cracks, head-in-pillow defects, insufficient wetting, lifted leads, broken internal connections, and even structural concerns inside complex multilayer assemblies. CT allows analysis of issues that may pass electrical test initially but become long-term reliability failures in the field.

As electronics continue to become smaller, denser, and more complex, CT inspection is rapidly becoming a critical tool for aerospace, defense, automotive, medical, and other high-reliability industries where failure is simply not an option.

A special recognition to Creative Electron, a true leader in the X-ray and CT inspection space. Bill Cardoso and the entire Creative Electron team are second to none when it comes to advancing inspection technology, supporting the electronics manufacturing industry, and helping companies improve quality and reliability through innovative imaging solutions.

At The Test Connection, Inc. (TTCI), we continue to see tremendous value in combining electrical test methodologies with advanced X-ray and CT inspection to create a more complete quality and reliability strategy for modern electronics manufacturing.

If you are attending this years SMTA Capital Expo make sure to stop by and ask Troy Johnson about our modular X-ray inspection system. Creative Electron’s modular platform is designed to grow alongside changing production demands with scalable CT capabilities, AI-driven inspection tools, and flexible workflows that adapt as products evolve. Whether you’re focused on improving quality, increasing process confidence, or preparing for next-generation designs, stop by The Capital Expo and connect with Troy to see how advanced inspection technology is reshaping electronics manufacturing.

05/10/2026

To all the mothers, grandmothers, stepmothers, mentors, and caregivers who keep life connected, grounded, and running strong The Test Connection, Inc. would like to wish you a very Happy Mother’s Day.

Much like the critical pathways on a circuit board, mothers provide the connections, support, guidance, and energy that keep families and future generations moving forward. In electronics, even the most advanced systems rely on strong, reliable connections to function properly and in life, those connections often begin with Mom.

At The Test Connection, Inc. we understand the importance of reliability, care, and attention to detail. Mothers demonstrate those qualities every single day through their strength, patience, compassion, and endless support. Today, we celebrate the women who help shape lives, inspire innovation, and hold everything together when it matters most.

Thank you for being the power behind the connection.
Happy Mother’s Day from all of us at The Test Connection, Inc.

05/09/2026

Understanding the Anatomy of a QFN Package

As electronic assemblies continue to become smaller, faster, and more power-dense, package technology plays a critical role in both manufacturing reliability and long-term field performance. One package style that has become extremely common across aerospace, defense, medical, automotive, and commercial electronics is the Quad Flat No-Lead (QFN) package. While compact and electrically efficient, QFN devices also introduce unique manufacturing, inspection, and test challenges that must be understood early in the design and production process.

A QFN package is designed with exposed thermal pads, perimeter terminals, internal wire bonds, and a lead frame structure that provides excellent electrical and thermal performance. The compact footprint reduces parasitic inductance and resistance, making the package ideal for high-speed digital, RF, and power-management applications. However, the same features that improve electrical performance can also create hidden solder joints and inspection limitations that require careful manufacturing controls.

At The Test Connection, Inc., we evaluate QFN assemblies from both a manufacturing and test engineering perspective. During process development and production support, we focus heavily on solder joint integrity, thermal pad solder coverage, voiding levels, coplanarity, wetting performance, and PCB land pattern design. Since many QFN solder joints are partially or fully hidden beneath the package body, traditional visual inspection alone is often insufficient. This is why X-ray inspection, electrical test coverage analysis, and Design for Test (DfT) practices become extremely important.

One of the most critical areas of concern is the large exposed thermal pad located underneath the component. This pad provides heat dissipation and grounding, but excessive solder volume or poor stencil design can create component float, solder voiding, opens, or insufficient side fillets. Thermal via design beneath the package also directly impacts solderability, heat transfer, and assembly yield. Poor via structures may wick solder away from the pad or create inconsistent thermal performance during reflow.

From a test engineering standpoint, QFN packages can create significant accessibility challenges for In-Circuit Test (ICT) and Flying Probe Test (FPT). Because the leads terminate underneath or along the edge of the package, direct probing access may be limited or unavailable. This requires careful DfT planning during PCB layout to ensure critical nets remain electrically accessible for validation, boundary scan, functional verification, and fault isolation. Without proper DfT considerations, troubleshooting failures later in production can become time-consuming and expensive.

Inspection strategy is equally important. Automated Optical Inspection (AOI) may only provide partial visibility depending on terminal style and package geometry. Side-wettable flanks can improve optical inspection capability by allowing visible solder fillets, while pull-back terminals may require greater reliance on X-ray or electrical testing. At TTCI, we frequently combine AOI, AXI/X-ray inspection, Flying Probe, ICT, and Functional Test strategies to achieve meaningful structural and electrical coverage across the assembly process.

Several industry standards support proper QFN implementation and inspection. IPC-A-610 establishes acceptability criteria for electronic assemblies, IPC-7093 provides guidance for Bottom Termination Components (BTCs) such as QFNs, and IPC-7351 supports land pattern design recommendations. IPC-2221 and IPC-2222 also contribute to PCB design practices that directly influence manufacturability and test accessibility.

Understanding the anatomy of a QFN package is not simply an academic exercise, it directly impacts yield, reliability, thermal management, inspection capability, and production test coverage. A well-designed manufacturing and test strategy can dramatically reduce false failures, improve first-pass yield, and enhance long-term product reliability.

At TTCI, we believe successful electronics manufacturing begins with understanding how design, assembly, inspection, and test all work together as a complete system.

04/28/2026

Tech Tip Tuesday – The Test Connection, Inc. (TTCI)

When it comes to production test development, the quality of your results is directly tied to the quality of the data you start with. One of the most common challenges we see at TTCI is not a limitation of the test platform, it’s the limitation of the input data. Legacy RS-274X Ge**er files, while still widely accepted, were never designed with test engineering in mind. They describe geometry, not intent. That means critical information for test development, net relationships, component definitions, and test access, must be reconstructed from multiple disconnected sources like drill files, netlists, and BOMs. This fragmentation introduces risk, increases engineering time, and often leads to inconsistencies that show up later as coverage gaps or debug delays.

From a test perspective, this becomes a front-end engineering bottleneck. Time that should be spent optimizing coverage, validating vectors, and improving fault detection is instead consumed by data alignment and interpretation. Whether developing for ICT, flying probe, or boundary scan, test engineers are forced to “reverse engineer the design” before they can even begin building an effective test strategy. This not only impacts schedule but can also affect the depth and accuracy of test coverage—especially on dense, high-reliability assemblies.

Modern intelligent formats like IPC-2581 and ODB++ change that dynamic completely. By delivering a single, integrated dataset that includes netlists, component placement, stack-up, and BOM information, they enable test development to begin with clarity and confidence. For ICT, this means faster program generation and more accurate node targeting. For flying probe, it improves access mapping and reduces debug iterations. For boundary scan, it ensures alignment between BSDL models and actual board connectivity. Even enhanced formats like Ge**er X2 help bridge the gap, but they still fall short of the full digital product model required for true test optimization.

For complex designs, HDI, fine-pitch BGAs, and mixed-technology assemblies, the difference is significant. Intelligent data reduces front-end engineering time, minimizes back-and-forth with customers, and allows TTCI to focus on what matters most: delivering robust, high-coverage test solutions. It also supports better correlation between design, manufacturing, and test, ensuring that what is verified electrically aligns with the original design intent.

At TTCI, we emphasize early engagement and proper data handoff as a critical part of test strategy success. Because in production test, the goal isn’t just to “test the board”, it’s to do it efficiently, accurately, and with confidence. And that starts with intelligent data.

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04/05/2026

At The Test Connection, Inc. (TTCI), we provide complete production electrical test solutions to support today’s high-reliability electronics.

From In-Circuit Test (ICT) and Flying Probe, to Boundary Scan (JTAG) and Functional Test, our team ensures your assemblies are validated for performance, coverage, and quality—whether in development or full production.

We’re also expanding beyond electrical test.

With the addition of advanced inspection capabilities, including 2D X-ray, 2.5D laminography, and full 3D CT, TTCI now delivers a more comprehensive approach—combining structural insight with electrical validation. This allows us to better support failure analysis, process validation, and quality assurance for complex and high-reliability assemblies.

As an ITAR Registered and ISO 9001:2015 certified organization, TTCI is highly experienced in working within controlled environments and understands the importance of complete, accurate documentation for both electrical test and inspection. From schematics and BOMs to CAD/ODB++ and assembly drawings, we help ensure your data package supports a successful test strategy.

When reliability matters, test and inspection must work together.

Let’s connect and discuss how TTCI can support your next program.

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02/21/2026

We just watched an impressive video from Creative Electron showcasing how advanced X-ray and CT technology is transforming battery inspection — and it’s a great reminder of why this capability matters.

Batteries are everywhere — aerospace systems, defense electronics, EV platforms, medical devices, and industrial controls. But what you can’t see inside a battery can absolutely impact safety and reliability.

With advanced 2D, 2.5D, and full 3D CT X-ray inspection, you can evaluate:

• Internal weld integrity
• Electrode stack alignment
• Voiding and delamination
• Foreign material contamination
• Potential short risks
• Post-stress structural shifts

Electrical testing tells you if it works.
X-ray shows you what’s happening inside.

At The Test Connection, Inc., we’re excited to bring this level of structural insight alongside our electrical test capabilities — giving customers deeper validation and stronger confidence in their assemblies.

Take a few minutes to watch the video from Creative Electron. It’s worth it. 🔎

If you’re building or validating battery-powered electronics, let’s talk.

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