BIWIN

BIWIN produces high-quality flash storage in embedded, consumer, corporate and industrial.

BIWIN's experience in production (along with its complete packaging, testing, and production lines) ensures BIWIN products are superior in performance, earning BIWIN many awards and a reputation for providing global customers with high-quality storage products. At the end of 2021, the company opened its latest facility, BIWIN Huizhou Science and Technology Zone, with a state-of-the-art R&D lab and 110,000 m2 of production. Our founders started in the flash storage business in Shenzhen, China in 1995, embracing the "WIN-WIN" business philosophy that would later become the hallmark for BIWIN. In 2009 they made a key decision for the business: to add IC encapsulation (or IC packaging) process into the factory. A remarkable milestone that the vast majority of competing companies still don't have (they outsource the process or buy the packaged IC packaged). This successful step led to the 2010 creation of the company we know today, BIWIN Storage Technology Company.

11/06/2026

Gear Up for Your AI Infrastructure, with BIWIN⚙️

We are excited to connect with industry leaders at electronica 2026, showcasing our latest memory and storage solutions for the enterprise, automotive, industrial, PC OEM, and embedded markets.

Highlights:

👉 Enterprise PCIe 5.0 SSDs for AI data centers

- SP5010 2.5-inch U.2 PCIe Gen5 x4 SSD, up to 122.88 TB, with reduced power consumption and TCO

- SP5002 E3.S & E1.L PCIe Gen5 x4 SSDs, up to 61.44 TB with QLC NAND

- SP509/SP519 2.5-inch U.2 PCIe Gen5 x4 SSD, delivering high peformance up to 14,700 MB/s and 4K random read performance of up to 3,200K IOPS.

📍 Booth number: Hall C6, Booth 140

📍 Location: Trade Fair Center Messe München, Germany

📅 Dates: Nov 10–13, 2026

11/05/2026

We are excited to connect with industry leaders at electronica 2026, showcasing our latest memory and storage solutions for the enterprise, automotive, industrial, PC OEM, and embedded markets.

Highlights:

👉 ePoP5X – Integrates LPDDR5X + eMMC 5.1 in a single package, offering up to 8,533 MT/s DRAM and 400 MB/s storage, ready to accelerate mass adoption of AI and AR applications.

📍 Booth number: Booth 140, Hall C6

📍 Location: Trade Fair Center Messe München, Germany

📅 Dates: Nov 10–13, 2026

11/03/2026

Gear Up for Your AI Infrastructure, with BIWIN⚙️

We are excited to connect with industry leaders at electronicaFair 2026, showcasing our latest memory and storage solutions for the enterprise, automotive, industrial, PC OEM, and embedded markets.

Highlights:

👉 Enterprise PCIe 5.0 SSDs for AI data centers

SP5010 2.5-inch U.2 PCIe Gen5 x4 SSD, up to 122.88 TB, with reduced power consumption and TCO

SP5002 E3.S & E1.L PCIe Gen5 x4 SSDs, up to 61.44 TB with QLC NAND

SP509/SP519 2.5-inch U.2 PCIe Gen5 x4 SSD, delivering high peformance up to 14,700 MB/s and 4K random read performance of up to 3,200K IOPS.

👉 ePoP5X – Integrates LPDDR5X + eMMC 5.1 in a single package, offering up to 8,533 MT/s DRAM and 400 MB/s storage, ready to accelerate mass adoption of AI and AR applications.

📍 Booth number: Booth 140, Hall C6

📍 Location: Trade Fair Center Messe München, Germany

📅 Dates: Nov 10–13, 2026

10/22/2026

BIWIN is excited to connect with industry leaders at electronica 2026, showcasing our latest memory and storage solutions for the enterprise, automotive, industrial, PC OEM, and embedded markets.

Highlights:

👉 SP509/519 Enterprise SSDs - High-performance 2.5-inch U.2 PCIe Gen5 x4 enterprise SSDs built for AI, cloud computing, and HPC workloads

👉 ePoP5X – Integrates LPDDR5X + eMMC 5.1 in a single package, offering up to 8,533 MT/s DRAM and 400 MB/s storage, ready to accelerate mass adoption of AI and AR applications.

👉 Mini SSD - Winner of TIME "Best Inventions of 2025" and an EDISON Award--announces the latest model BL130 Mini SSD with 3700/3400 MB/s and the size of a small coin.

📍 Booth number: Booth 140, Hall C6

📍 Location: Trade Fair Center Messe München, Germany

📅 Dates: Nov 10–13, 2026

10/15/2026

We’re honored that our AI-end flagship, the ePoP5X, has won a 2026 Most Innovative Product award from .

BIWIN ePoP5X was designed for compact smart wearables. It integrates eMMC 5.1 and LPDDR5X in a single ePoP package, saving over 40% PCB space. It delivers LPDDR5X speeds up to 8,533 MT/s, capacities up to 64GB + 32Gb, and an ultra-thin profile as low as 0.51mm — with stable operation from -25°C to 85°C.

Today, BIWIN powers leading AI/AR glasses and wearable brands, has entered the supply chains of top global PC OEMs, and serves more than 40 automotive OEMs and Tier-1 suppliers. Our service network covers Asia, North America, South America, and Europe.

Thank you, Embedded Computing Design. We’ll keep pushing memory and storage innovation — from edge to cloud.

10/13/2026

We’re proud to share that our Chairman, Sam Sun, has been named among ’s 2026 Most Innovative People.

This recognition reflects the innovation strategy Sam Sun has championed at BIWIN — an integrated model spanning R&D, packaging, and testing, from storage media design to full-stack product delivery. Under his leadership, we’ve built a strong global patent portfolio of 582 patents, including 245 invention patents, covering AI-end, industrial & automotive, enterprise, and PC OEM storage.

Innovation at BIWIN is not just about technology. It’s about long-term strategy, disciplined ex*****on, and empowering our teams to turn bold ideas into reliable products for customers worldwide.

Thank you, Embedded Computing Design, for this honor. Congratulations to Sam Sun and to every BIWIN team member who contributes to our innovation journey.

09/25/2026

Embedded World North America 2026 has come to a successful close!

Over the past few days, we’ve showcased a broad portfolio of memory and storage solutions spanning enterprise, automotive, industrial, PC OEM, and embedded applications.

From PCIe 5.0 enterprise SSDs built for AI and data center workloads, to high-capacity storage, ePoP5x, LPDDR5X, Mini SSD, and solutions for embedded and edge applications, our focus remains the same: enabling faster, more efficient, reliable, and highly integrated systems.

Thank you to all our customers, partners, and industry professionals for the great conversations and insights throughout the show.

We look forward to continuing these discussions and building what’s next together.

09/24/2026

The conversations continue at embedded world Exhibition&Conference North America 2026!

At Booth #6104, discover:

👉 ePoP5x — Integrating LPDDR5X + eMMC 5.1 in a single package—offering up to 8,533 MT/s DRAM and 400 MB/s storage, ready to accelerate mass adoption of AI and AR applications.

👉 LPDDR5X — High-bandwidth, power-efficient memory built to support increasingly demanding embedded, edge AI, and intelligent device workloads.

👉 Mini SSD - Winner of TIME "Best Inventions of 2025" and an EDISON Award--announces the latest model BL130 Mini SSD with 3700/3400 MB/s and the size of a small coin.

Stop by Booth #6104 and meet our team to explore the technologies behind the next generation of intelligent systems.

09/23/2026

We’re live at embedded world North America 2026 in Anaheim!

At Booth #6104, discover:

👉 SP509/519 Enterprise SSDs — PCIe 5.0 solutions engineered for AI training and inference, cloud-native applications, and high-performance computing workloads.

👉 SP5002 Enterprise SSDs — High-capacity E3.S & E1.L solutions offering up to 61.44 TB per drive and up to 14,700 MB/s read performance, designed for AI and hyperscale data infrastructure.

Stop by Booth #6104 and meet the BIWIN team to explore how our storage technologies can support your next-generation applications.

Address

8725 NW 18th Terrace, Suite #400
Miami, FL
33172

Website

https://biwintechnology.com/

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