BIWIN

BIWIN produces high-quality flash storage in embedded, consumer, corporate and industrial.

BIWIN's experience in production (along with its complete packaging, testing, and production lines) ensures BIWIN products are superior in performance, earning BIWIN many awards and a reputation for providing global customers with high-quality storage products. At the end of 2021, the company opened its latest facility, BIWIN Huizhou Science and Technology Zone, with a state-of-the-art R&D lab and

110,000 m2 of production. Our founders started in the flash storage business in Shenzhen, China in 1995, embracing the "WIN-WIN" business philosophy that would later become the hallmark for BIWIN. In 2009 they made a key decision for the business: to add IC encapsulation (or IC packaging) process into the factory. A remarkable milestone that the vast majority of competing companies still don't have (they outsource the process or buy the packaged IC packaged). This successful step led to the 2010 creation of the company we know today, BIWIN Storage Technology Company.

05/12/2026

We are incredibly proud to share that BIWIN Mini SSD has received a Bronze Award at the 2026 Edison Awards – one of the most respected global honors for innovation, design, and impact. 💡

Selected from over 1,000 international entries, our Mini SSD was evaluated by an independent panel of senior scientists, engineers, and industry leaders on three critical dimensions: Concept, Value, and Impact.

What makes the Mini SSD a breakthrough? 🚀

We took the power of a full-size SSD and shrank it to smaller than a coin – enabling a new generation of compact, connected devices without compromising performance.

Powered by PCIe 4.0 x2 and NVMe 1.4, with advanced 3D TLC NAND technology, it delivers:

👉 Read/write speeds up to 3700 / 3400 MB/s

👉 Capacities up to 2 TB

Congratulations to all the 2026 honorees. And a huge thank you to our teams who made this possible.

🔗 Learn more about the BIWIN Mini SSD: https://www.biwintechnology.com/product/mini-ssd/

04/29/2026

📢 Exciting News: BIWIN Mini SSD Named Bronze Winner at the 2026 Edison Awards

We are proud to share that the BIWIN Mini SSD has been recognized as a Bronze Winner at the 2026 Edison Awards, honoring its breakthrough innovation in performance, miniaturization, and next-generation storage design.

With an ultra-compact form factor of just 15.0 × 17.0 × 1.4 mm, this groundbreaking storage solution delivers read/write speeds of up to 3700 / 3400 MB/s — redefining what’s possible for high-density storage in space-constrained devices.

This latest recognition adds to a growing list of global accolades for the BIWIN Mini SSD, including:

🏆 TIME Best Inventions of 2025

🏆 TechRadar "Best in Show" at MWC 2026.....

Representing BIWIN at the awards ceremony were Sam Sun, Chairman; Kevin Xu, SVP; and Will Lin, General Director, who accepted the honor on behalf of the entire BIWIN team. This achievement belongs to everyone at BIWIN whose dedication, expertise, and vision continue to drive our innovation forward.

We remain committed to pushing the boundaries of storage technology and enabling the next generation of smart devices.

🔗 Learn more about BIWIN Mini SSD: https://www.biwintechnology.com/product/mini-ssd/

04/27/2026

In 2025, BIWIN achieved a significant milestone, with annual revenue surpassing 1.65 billion USD, representing a year‑on‑year increase of 68.8%. Profit quality improved significantly – net profit attributable to equity holders more than quadrupled, with basic EPS reaching 1.87 yuan.

Our strategic focus on AI‑driven edge storage continues to pay off. Revenue from AI emerging edge storage products reached 1.75 billion yuan, while our AI glasses storage business contributed approximately 0.96 billion yuan – representing a stunning 378% CAGR from 2023 to 2025.

We also deepened our technology moat. R&D expenses grew 41%, and our R&D headcount expanded by over 40% to 1,262 people – now accounting for 44% of our total workforce. This commitment is reflected in our intellectual property: 521 domestic and international patents (including 217 invention patents) and 66 software copyrights.

On the manufacturing front, we continue to lead in advanced packaging. We have mastered high‑volume capabilities for 16/32‑layer stacked die, 30–40 µm ultra‑thin die, and multi‑chip heterogeneous integration. Our wafer‑level packaging portfolio now covers 2.5D, Chiplet, RDL and Fanout, anchored by our FOMS and CMC product lines.

None of this would be possible without the relentless dedication of our global team. Thank you.

We are entering the AI era with confidence, clarity, and a clear technology roadmap. The best is yet to come.

04/07/2026

A quick rewind with .tech on what BIWIN brought to embedded world 2026.

From wafer sourcing and in-house controller development to advanced packaging and manufacturing, BIWIN delivers end-to-end storage solutions for embedded, industrial, and automotive applications.

Here are our STAR PRODUCTS:

💡 ePoP5X — Winner of embedded world 2026 Best in Show. Integrating LPDDR5X and eMMC in an ultra-compact design, it delivers up to 75% PCB space savings and speeds of up to 8,533 Mbps for AI devices and AR smart glasses.

💡 TAE308/318 Automotive eMMC 5.1 — Designed for demanding in-vehicle environments with fast data transfer, strong durability, and AEC-Q100 compliance.

💡 Mini SSD — Up to 3700/3400 MB/s in an ultra-compact 15 × 17 × 1.4 mm form factor. Recognized by TIME Best Inventions 2025 and named Best in Show at MWC 2026 by TechRadar.

Watch the video for a closer look at BIWIN’s innovations at .

04/03/2026

Designed for high-definition, multi-channel video surveillance, the BIWIN TDC200 Industrial SD & microSD cards deliver reliability where it matters most.

With optimized firmware for continuous multi-channel writing, rugged physical design, and endurance across -25°C to +85°C, these cards thrive in demanding environments.

Waterproof, dustproof, shock-resistant, and protected against X-rays and magnetic interference — TDC200 is built for vehicle surveillance, security systems, industrial inspections, medical monitoring, and beyond.

03/13/2026

What a fantastic week at embedded world 2026!

Our booth was buzzing with energy as industry leaders stopped by to explore BIWIN’s latest storage innovations and advanced chip packaging and testing capabilities. 🚀

From AI-powered devices to industrial and automotive systems, there were lively discussions around how high-performance, reliable storage is shaping the future of embedded technology.

The spotlight shone bright on our standout innovations:

💡 ePoP5X - “Best in Show” winner by Embedded Computing Design (ECD)

💡 TAU208 Automotive UFS 3.1 with AEC-Q100 compliance and stable operation from -40°C to 105°C

💡 Comprehensive industrial-grade storage solutions including eMMC, LPDDR, 2.5” SATA/M.2 SSDs and microSD/SD cards

💡 Ultra-compact Mini SSD - “Best in Show” winner by TechRadar

We’re excited to keep the momentum going and continue building the future of intelligent storage together.

03/12/2026

From wafer sourcing and in-house controller development to advanced packaging and manufacturing, BIWIN delivers end-to-end storage solutions across the entire value chain. 🚀

Supported by specialized subsidiaries GBAT and GBCC, BIWIN enables cutting-edge technologies including multi-layer stacked die packaging and wafer-level memory–computing integration.

These capabilities power BIWIN’s latest innovation in embedded, industrial, automotive and enterprise storage:

💡 ePoP5X — Winner of the 2026 embedded world “Best in Show”. Integrates LPDDR5X and eMMC in an ultra-compact design, delivering up to 75% PCB space savings and speeds of up to 8,533 Mbps, ideal for AI and AR glasses.

💡 TAU208 Automotive UFS 3.1 — High-performance automotive storage with AEC-Q100 compliance, operating reliably from -40°C to 105°C for demanding automotive environments.

💡 Industrial Storage Solutions — Wide-temperature eMMC, LPDDR, and SSDs designed for harsh industrial systems, offering high endurance, low power consumption, and long lifecycle support.

💡 Mini SSD — Delivers 3700/3400 MB/s in an ultra-compact 15 × 17 × 1.4 mm form factor. Winner of TIME Best Inventions 2025 and “Best in Show” at MWC 2026 by TechRadar.

📍 Visit us at Booth #1-140, Hall 1 to learn more.

03/11/2026

BIWIN at embedded world 2026 — Powering Embedded Systems with Reliable Storage

As embedded technologies continue to advance—from edge AI to industrial automation—reliable, high-performance storage plays a vital role in enabling fast data processing, system stability, and long-term operation.

With high-quality wafers, in-house controller development, and advanced packaging expertise, BIWIN delivers end-to-end storage solutions across the entire value chain.

BIWIN operates fully integrated packaging, testing, and manufacturing facilities, including two specialized factories:

🏭 Greater Bay Advanced Technology (GBAT) for multi-layer stacked die, ultra-thin die packaging, and heterogeneous integration;

🏭 Greater Bay Chiplet Company (GBCC) for wafer-level memory–computing integration and comprehensive packaging services.

These capabilities power BIWIN’s latest innovation in embedded storage: BIWIN ePoP5X, winner of the 2026 embedded world “Best in Show” Award from Embedded Computing Design. 🏆

BIWIN ePoP5X integrates LPDDR5X and eMMC in an ultra-compact design, delivering up to 75% PCB space savings and speeds of up to 8,533 Mbps—ideal for AI and AR glasses.

🔗 https://lnkd.in/gsfAFs6G

📍 Visit us at Booth #1-140, Hall 1 to learn more.

03/05/2026

Incredible four days at MWC 2026 connecting with industry leaders and innovators!

As AI continues to shift toward the edge and networks evolve from 5G to 6G, the demand for smaller, faster, and more intelligent device architecture has never been greater. Proud to have showcased how BIWIN is driving that transformation forward.

💡 Industrial Storage Solutions

Wide-temperature eMMC, LPDDR, and SSDs built for 5G infrastructure and harsh environments—offering high endurance, low power, and long-life support.

💡 ePoP5X

Ultra-compact LPDDR5X + eMMC integration, up to 75% PCB space saving, and speeds up to 8,533 Mbps—ready for AI/AR Glasses.

💡 Mini SSD

3700/3400 MB/s in a 15×17×1.4mm form. Winner of TIME Best Inventions 2025 & "Best in Show" at MWC 2026 by Techradar.

💡 SP506/SP516 Enterprise SSDs

PCIe Gen5x4, 2×Gen4 bandwidth, in U.2/E1.S/E3.S—built for AI servers, cloud, and hyperscale data centers.

The future of storage is compact, intelligent, and edge-ready.

03/04/2026

Visit us at Booth CS104 to explore:

💡 Industrial Storage Solutions
Wide-temperature eMMC, LPDDR, and SSDs built for 5G infrastructure and harsh environments—offering high endurance, low power, and long-life support.

💡 ePoP5X
Ultra-compact LPDDR5X + eMMC integration, up to 75% PCB space saving, and speeds up to 8,533 Mbps—ready for AI/AR Glasses.

💡 Mini SSD
3700/3400 MB/s in a 15×17×1.4mm form. Winner of TIME Best Invention 2025 & "Best in Show" at MWC 2026 by techradar.

💡 SP506/SP516 Enterprise SSDs
PCIe Gen5 x4, 2× Gen4 bandwidth, in U.2/E1.S/E3.S—built for AI servers, cloud, and hyperscale data centers.

Address

8725 NW 18th Terrace, Suite #400
Miami, FL
33172

Website

https://biwintechnology.com/

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