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08/28/2026

Adaptsys to Exhibit 3DInspect at Micronora 2026: HAMPSHIRE, UK — The Adaptsys Group will exhibit its award-winning 3DInspect automated inspection system at Micronora, taking place September 29 through October 2, 2026, in Besançon.

Micronora is a leading international event dedicated to precision engineering, miniaturization, and the integration of complex functions—making it an ideal platform to showcase innovations that improve quality and efficiency in microtechnology manufacturing.

At the exhibition, Adaptsys will highlight 3DInspect, an advanced system designed to automate carrier tape inspection and reporting. Developed to eliminate bottlenecks in verification processes, 3DInspect replaces manual measurement and handwritten documentation with a fast, repeatable digital workflow.

The system enables manufacturers to complete inspection and generate Certificates of Conformance (CoCs) in approximately one minute—compared to up to 30 minutes using traditional methods—while improving accuracy, consistency, and traceability.

Visitors to the show will have the opportunity to learn how 3DInspect supports high-value and sensitive component handling by standardizing measurement and delivering clear, reliable documentation for quality assurance and customer compliance.

For more information, visit www.adaptsys.com.

August 2026

08/28/2026

CE3S Appoints John Romanowicz as Sales Manager: HARRISBURG, PA — Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic so urcing, professional solutions and distribution partner, has appointed John Romanowicz as Strategic Sales Development Manager. In his new role, Romanowicz will focus on new business growth, account development, customer expansion and strengthening CE3S’s relationships throughout the electronics manufacturing market.

Romanowicz will work closely with both prospective and existing customers to identify new opportunities, develop strategic accounts and support the company’s continued expansion. His responsibilities will include cultivating new business relationships, expanding existing customer engagements and helping CE3S identify opportunities to deliver greater value to customers across the electronics manufacturing supply chain.

“John brings a strong customer-focused perspective and will be an important addition to our sales development efforts,” said Jeremy Wagner, President, CE3S. “As we continue to pursue new opportunities and expand our relationships throughout the electronics manufacturing market, John’s focus on account development and customer engagement will help support our long-term growth strategy.”

In addition to developing new business, Romanowicz will play an important role in strengthening relationships with existing CE3S customers. His efforts will support the company’s objective of building long-term partnerships while identifying additional ways CE3S can meet evolving customer requirements.

“I’m excited to join CE3S and be part of a team that is focused on building strong customer relationships and creating new opportunities for growth,” said Romanowicz. “I look forward to working with the team and customers to help expand CE3S’s presence across the electronics manufacturing market.”

Romanowicz’s appointment further strengthens CE3S’s sales organization and supports the company’s continued commitment to customer development, strategic growth and long-term market expansion.

For more information about CE3S, please visit www.ce3s.com or contact [email protected].

August 2026

08/28/2026

BTU: Advanced Formic Acid Reflow Capability for Fluxless Semiconductor Packaging: WESTFORD, MA — BTU International, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor industries, today announced the availability of an advanced Formic Acid Reflow capability across multiple reflow oven platforms. Designed to support the increasing demands of advanced semiconductor packaging, power devices, and high-reliability electronic assemblies, the new process option enables fluxless soldering while delivering exceptional process control, lower operating costs, and superior solder joint quality.

As semiconductor packages continue to shrink while increasing in complexity, manufacturers require reflow processes capable of minimizing oxidation, reducing contamination, and improving long-term reliability. BTU’s new Formic Acid Reflow capability achieves ultra-low oxygen levels within the reflow chamber – reaching single-digit parts per million (ppm) – to provide an exceptionally clean processing environment that promotes superior solder wetting and consistent, repeatable results.

Unlike conventional systems that expose the entire thermal process to formic acid, BTU utilizes concentrated, targeted formic process zones, delivering the chemistry precisely where oxide reduction is required. This focused approach significantly reduces overall formic acid consumption while maintaining effective oxide removal, lowering operating costs and improving environmental efficiency without compromising process performance.

A key advantage of BTU’s solution is its availability across multiple reflow platforms, allowing customers to select the system best suited for their application. The capability is fully compatible with BTU’s industry-leading TrueFlat® technology, enabling manufacturers of ultra-thin substrates, advanced IC packages, and AI devices to combine fluxless processing with proven substrate warpage control. By maintaining exceptional thermal uniformity and minimizing mechanical distortion throughout the reflow process, TrueFlat technology helps maximize yields for today's increasingly thin and fragile package designs.

“The transition toward finer interconnects, thinner substrates, and higher reliability requirements is driving increased adoption of fluxless reflow technologies,” said Rob DiMatteo General Manager of BTU International. “By combining ultra-low oxygen processing, highly efficient formic acid utilization, and compatibility with our TrueFlat and other industry-leading reflow platforms, BTU is delivering a solution that helps customers improve process performance while reducing operating costs.”

BTU’s Formic Acid Reflow capability is well suited for a broad range of semiconductor manufacturing applications, including advanced packaging, flip chip, power devices, wafer-level packaging, and other high-reliability soldering processes where minimizing oxidation and residue is critical. The combination of precise atmosphere control, targeted formic acid delivery, and BTU's industry-recognized thermal process expertise provides manufacturers with a robust, production-ready solution for next-generation semiconductor assembly.

More information about BTU International is available at www.btu.com.

August 2026

08/28/2026

Attend Seika Machinery’s Sixth SMI 2026 Webinar: TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will present the sixth session of its SMI 2026 Summer Webinar Series on Wednesday, September 2 at 10 a.m. PST. “How SAWA Cleaners 4.0 Contribute to Stencil Cleanliness and Optimal Paste Printing Results” will highlight SAWA’s approach to stencil management and the role effective cleaning, inspection and storage can play in achieving consistent solder paste printing and SMT production quality.

The webinar will introduce the SAWA SMT One-Stop Solution, a fully automatic stencil cleaning, inspection and storage system designed to support the complete stencil management process. The solution combines automated stencil loading and unloading, cleaning and drying, stencil inspection, and intelligent storage and traceability capabilities.

Maintaining stencil cleanliness is an important part of achieving consistent paste printing results. Contamination and residue can affect paste transfer and contribute to printing-related defects, making effective stencil cleaning an important element of overall SMT process control.

“Stencil management is an integral part of maintaining consistent and efficient SMT production,” said Michelle Ogihara, EVP of Seika Machinery, Inc. “With the SAWA SMT One-Stop Solution, manufacturers can look beyond cleaning alone and consider the entire stencil management process, from loading and cleaning through inspection, storage and traceability. We look forward to showing attendees how these technologies can work together to support better process control and optimal paste printing results.”

During the webinar, Seika will introduce several technologies within the SAWA SMT One-Stop Solution, including the SA-MA5 Series automatic stencil loading and unloading system, which can be customized to meet individual production requirements. The presentation will also cover the SAWA SC-AH150E Stencil Cleaner, which provides cleaning and drying in approximately 3.5 minutes while emphasizing efficient, environmentally friendly and sustainable operation. The SAWA SH-T100 Stencil Inspection system provides automated stencil inspection capabilities, including GE**ER comparison, stencil hole testing, automatic stencil tension testing and SPC reporting with MES upload. The system is designed to inspect holes in the 15-40 µm range. For stencil storage, the SAWA SH-MAS provides an intelligent stencil management system with categorized and zoned storage for easy access and retrieval. The system also supports full-process stencil traceability management and can be customized according to production requirements.

The webinar will also include an introduction to the new SAWA Ecobrid SC-AH150 Automatic Stencil Cleaner. The SC-AH150 incorporates Seika’s Ecobrid Cleaning Method, combining ultrasonic vibration, cleaning-liquid spray and suction to clean stencils while improving cleaning performance and efficiency.

Together, the SAWA solutions provide manufacturers with a comprehensive approach to stencil management, helping streamline handling, cleaning, inspection and storage while supporting traceability throughout the process.

The webinar will conclude with a live Q&A session, giving attendees an opportunity to ask questions about stencil cleaning, inspection, storage and SAWA’s automated stencil management solutions.

The webinar is complimentary, but advance registration is required: Register for the webinar.

For more information, visit Seika Machinery to Demo Smart Cleaning, Depaneling, and Process Control Solutions at SMTA Guadalajara 2026: Article | Seika Machinery Inc or contact Michelle Ogihara at 310-540-7310; e-mail [email protected].

August 2026

08/28/2026

Microscreen Opens New Facility in Oxford, CT: OXFORD, CT — Microscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, is pleased to announce the opening of its newest facility in Oxford, CT. The new location expands the company’s manufacturing capacity and provides faster service to customers throughout the Northeast.

Headed up by Jeff Poulos, Microscreen’s East Coast Regional Manager, the Oxford facility opening marks another step in Microscreen’s continued investment in U.S. manufacturing operations and long-term growth plans. The 8,000 sq. ft. facility manufactures SMT stencils with a 24-hour turnaround. Additionally, the location puts customers from Maine to Philadelphia in range for one day ground shipping.

“We’ve been looking at ways to better support our customers in the Northeast, and Oxford made perfect sense for us,” said Nik Thomas, Director, Microscreen. “We have an experienced team in place, and we are continuing to invest in in new equipment that will allow us to offer even more capabilities for our customers.”

Microscreen’s Oxford facility is equipped with a Tannlin T11 laser system, capable of cutting approximately 10,000 to 15,000 apertures per hour. A Watt Laser SE12 Pro also is in operation for stencil inspection, step welding and aperture measurement.

Microscreen manufactures all major frame types and foil systems at the facility, including VectorGuard, Apshen quick-mount adapter systems, QTS Wizard and rework stencils. Datum PhD and Datum Fine Grain (FG) stainless steel foils are available, along with green frames for lead-free applications.

Microscreen has been manufacturing screens and stencils for more than 45 years. The company provides customers with a single source for SMT stencils, nanocoatings, precision screens and custom tooling.

For more information about Microscreen’s Oxford facility, call 574-232-4358, email [email protected], or visit www.microscreen.com.

August 2026

08/28/2026

Count On Tools Adds Two Custom SMT Nozzles: GAINESVILLE, GA ― Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, has introduced two new custom nozzle solutions designed to address challenging component placement applications on Samsung and Quad pick-and-place systems.

The first, Part No. 2017-3719, is a custom Samsung nozzle engineered for CP45, SM10, and SM421 series machines. It features a CN-style nozzle base with a keyed/pinned design and a keyed reflector, ensuring repeatable orientation and alignment. The nozzle incorporates a 2.0 mm x 11.50 mm OD x 1.0 mm blade-type tip with an 8.0 mm vacuum slot, specifically configured to reliably handle the Panasonic PK5S 80-pin header during high-speed assembly.

The second, Part No. 2021-4793, is a custom Quad QSP nozzle built with a 0.175" x 0.175" flat plastic tip. It includes dual 0.025" diameter vacuum holes spaced just 0.005" apart, a configuration that provides balanced suction and stable pickup for small or irregularly shaped components that standard round nozzles cannot securely grip.

Both nozzles were developed in response to specific customer requirements where off-the-shelf tooling proved inadequate. The keyed reflector and vacuum slot design on the Samsung-compatible nozzle eliminates orientation errors, while the closely spaced vacuum holes on the Quad nozzle address the need for precise, non-marring contact on delicate surfaces. These additions expand Count On Tools' already extensive portfolio of custom tooling for fine-pitch, odd-form, and high-density applications.

Count On Tools manufactures a complete line of standard and custom SMT nozzles, tooling, and precision machined components for leading pick-and-place platforms. The company's in-house engineering and CNC machining capabilities enable rapid turnaround on custom geometries, with each nozzle verified to meet application-specific tolerance and performance requirements.

For more information, email Count On Tools’ sales team at [email protected] or visit www.cotinc.com.

August 2026

08/26/2026

Technica Signs Strategic Partnership with Rehm: SAN JOSE, CA — Technica USA is pleased to announce a new strategic partnership with Rehm Thermal Systems. Under the distribution agreement, Technica USA will represent Rehm throughout the Western and West South-Central regions of the United States, expanding access to Rehm’s advanced thermal processing technologies and solutions for the electronics manufacturing industry.

Jason Perry, President of Technica USA, stated, “We are very pleased to establish this strategic partnership with Rehm. Since 1990, Rehm has established itself as a leading manufacturer of advanced thermal processing equipment for the electronics industry. Its portfolio of reflow soldering systems utilizing convection and condensation technologies, along with its drying and coating solutions, is recognized worldwide for process performance, reliability, and innovation.”

Perry continued, “A prime example of Rehm’s innovative approach is the new Vision TripleX platform, an advanced 3-in-1 solution combining v***r phase and convection soldering technologies, with or without vacuum capability. This unique platform provides manufacturers with exceptional process flexibility while addressing the increasingly demanding requirements of today’s electronics manufacturing environment.”

With more than three decades of experience, Rehm Thermal Systems has built a strong reputation for technical expertise, process reliability, and forward-thinking thermal processing solutions. The company’s portfolio encompasses eight core process technologies, including convection, condensation, and contact heat soldering, as well as coating, drying and curing, inspection and testing, and metallization solutions.
Pictured (L-R) Kristoffer Unger-Rehm, Jason Perry-Technica USA, Michael Hanke-Rehm.

Mike Hanke, Chief Sales Officer of Rehm Thermal Systems, commented, “We are very pleased to partner with Technica USA and look forward to working closely with their team. With the support of Technica’s experienced sales and equipment service organization, Rehm is further strengthening its commitment to U.S. customers by providing advanced, future-ready technologies designed to deliver maximum process reliability and performance.”

Perry added, “Rehm is an outstanding addition to Technica USA’s existing product portfolio. We are privileged to represent some of the world’s leading manufacturers serving the PCB assembly, substrate, and semiconductor markets, and this partnership further strengthens our ability to provide our customers with advanced manufacturing technologies and comprehensive process solutions. We look forward to building a long and successful relationship with Rehm and creating greater value for our customers.”

As a subsidiary of EMC Taiwan, Technica USA continues to expand its market presence and broaden its portfolio of advanced manufacturing technologies across established and emerging markets. The strategic partnership with Rehm Thermal Systems represents another important step in that growth, reinforcing Technica USA’s commitment to providing customers with world-class equipment, technical expertise, and innovative manufacturing solutions.

For more information give us a call at (408) 240-5950 from 9 AM to 8 PM EST or send us email to [email protected] or visit us at www.technica.com.

August 2026

08/26/2026

Nordson Electronics Launches Vantage XL for PLP: See Nordson Electronics at SEMICON Taiwan, Booth I.2308

CARLSBAD, CA — Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications.

The ASYMTEK Vantage XL extends Nordson's proven Vantage dispensing platform to larger panel formats, enabling manufacturers to develop next-generation advanced packaging processes and scale production with greater accuracy, throughput, and process control.

Panel-level packaging (PLP) enables higher throughput and lower manufacturing costs compared to wafer-level operations, especially as package sizes grow and throughput demands accelerate for artificial intelligence (AI) applications and automotive electrification. However, scaling large-format panels introduces challenges including warpage control, thermal management, and dispensing accuracy, all of which require specialized process controls.

Designed specifically to address these challenges in PLP, the ASYMTEK Vantage XL Fluid Dispensing System delivers:

* Improved dispensed underfill flow and warpage mitigation for void-free results.

* Flexible tooling support for large panel sizes during semiconductor manufacturing.

* Integrated thermal management for rapid heating and temperature uniformity across the substrate.

* Multi-fiducial capture for fast, accurate alignment.

* Confocal height sensing for reflective and transparent glass panels.

* Post-dispense inspection for efficient and process rework.

* Based upon the popular Vantage dispensing system, in a larger platform frame to accommodate common panel sizes.

The new ASYMTEK Vantage XL fluid dispensing system will be on display during SEMICON Taiwan 2026, booth . In addition, Nordson will highlight the new MARCH ExoSPHERE™ plasma treatment system, which supports PLP and other advanced packaging processes by providing uniform surface preparation for panels and wafers. SEMICON Taiwan 2026 will be held at TaiNEX Hall 1, Taipei, Taiwan, September 2-4, 2026.
Visit Nordson Electronics Solutions makes reliable electronics a reality.

August 2026

08/26/2026

KYZEN: AI Chip Reliability and Advanced Packaging: See KYZEN at SEMICON Taiwan, Booth I2423


NASHVILLE, TN — KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit in Booth I2423 at SEMICON Taiwan from September 2-4, 2026, at TaiNEX Hall 1 and 2 in Taipei, Taiwan. KYZEN’s team of experts will highlight cleaning technologies designed to address the increasingly complex requirements of advanced AI and semiconductor packaging processes.

As Artificial Intelligence (AI) applications continue to grow, semiconductor packaging technologies are undergoing significant transformation. Advanced packaging processes including CoWoS and CoPoS, together with heterogeneous integration, large die sizes, 3D stacking technologies and increasingly small gap spaces, are creating new challenges for effective cleaning.

Within these highly precise processes, residual flux can present a significant challenge to product reliability. Inadequate cleaning can contribute to electrochemical migration, leakage currents and component failure, making effective flux residue removal increasingly important as packaging complexity increases.

At SEMICON Taiwan, KYZEN will showcase its latest flux cleaning technologies and innovative cleaning solutions developed to support advanced AI processes and help manufacturers achieve high reliability standards.

For more than 35 years, KYZEN has developed cleaning chemistries and process solutions to help electronics manufacturers achieve reliable cleaning results while improving process efficiency. As advanced packaging architectures become increasingly complex, the company continues to apply this cleaning expertise to the evolving challenges presented by semiconductor manufacturing.

KYZEN will also use SEMICON Taiwan to formally announce Gary Liu as Sales Leader – North Asia, a position he assumed in late 2025. In his role, Liu is focused on supporting KYZEN’s continued growth within the region’s semiconductor market and working closely with Regional Managers and R&D teams to accelerate customer evaluations and qualifications. With North Asia serving as a global center for semiconductor packaging R&D and high-volume manufacturing, the region represents an important part of KYZEN’s continued semiconductor expansion.

“North Asia is a global center for semiconductor packaging R&D and high-volume manufacturing, spanning advanced packaging and IC substrates,” said Liu. “With AI-driven growth accelerating demand for these technologies, the need for robust, high-yield process solutions is increasing rapidly. Close collaboration with our Regional Managers and R&D teams will be essential to accelerate qualifications and drive sustained success.”

Visitors to SEMICON Taiwan are invited to meet KYZEN’s cleaning experts at Booth I2423 to discuss the latest flux cleaning technologies and solutions for advanced AI and semiconductor packaging applications.

For more information, visit www.kyzen.com.

August 2026

08/26/2026

ViTrox Empowers Next-Gen Advanced Packaging: See ViTrox at SEMICON Taiwan, Booth P6006

PENANG, MALAYSIA — ViTrox, which aims to be the World’s Most Trusted Technology Company, is excited to announce its participation in SEMICON Taiwan 2026, one of the world’s leading semiconductor industry events. The exhibition will take place from 2 to 4 September 2026 at TaiNEX 1 & 2 in Taipei, Taiwan. Visitors can visit ViTrox at TaiNEX 2, 1F, Malaysia Pavilion, Booth .

The semiconductor industry continues to face increasing challenges as packaging architectures such as SiP, memory technologies like HBM, and advanced processes such as CoWoS become more widely adopted. While these technologies enable higher performance and integration, they also introduce greater process complexity and stricter quality requirements.

Key challenges include:

* Precision Bottlenecks: Sub-micron defect detection requires inspection capabilities beyond conventional methods.

* Hidden Complexity: Advanced 3D structures often conceal internal defects that are difficult to detect.

* Yield Pressure: Rising investment in advanced manufacturing places greater emphasis on first-pass yield and equipment efficiency.

At SEMICON Taiwan 2026, ViTrox will showcase a fully integrated inspection ecosystem that seamlessly supports the entire semiconductor manufacturing journey, delivering end-to-end quality assurance from wafer to board level. At the Wafer Level, we address the earliest stages of manufacturing with the WiX Ai Smart Wafer AOI Machine. This is a unified platform that gives fabs full-depth wafer visibility, from surface to inner layer, before wafers progress to later stages. It detects sub-micron surface defects (< 1 µm) with AI-enhanced accuracy, while proprietary SWIR technology uncovers hidden inner cracks that conventional inspection cannot see.

During Die Sorting & Packaging, once the wafer is transformed into dies, precision sorting becomes critical. Our PX40Ai Smart Die Sorting Machine streamlines high-speed sorting, six-sided inspection, and tape-and-reel packaging, replacing conventional manual inspection with exceptional accuracy and improved production efficiency.

Designed to address the growing complexity of advanced packaging, the TH3000i Smart Tray Based Vision Handler combines an adaptive vision system with AI-powered defect detection to support diverse package inspection requirements. Building on this intelligent inspection capability, V-ONE In-Process Verification further enhances overall inspection efficiency by enabling remote inspection review and verification. During Final Assembly & Post-Seal, the VR20Ai G2 Smart Post Seal Vision Handler minimises machine idle time through a high-speed dual-track system design, while supporting automated tape insertion and width conversion (8 to 32 mm), ensuring compliance with international quality standards.

At the Strip & Board Level Inspection stage, the V510Ai Smart 3D AOI System for Substrate-Level and SiP Inspection utilises high-resolution 3D measurements and SWIR imaging to detect surface anomalies, component offsets, and inner die cracks on strips and complex high-density modules, ensuring robust inspection for IC package integrity.

During the show, ViTrox will also introduce our SMT Full Line Solutions, including Smart 3D SPI, Smart 3D AOI System, Smart 3D AXI System, and Smart Robotic Optical System (ARV). These smart manufacturing solutions are linked to ViTrox’s Manufacturing Intelligence Solutions Towards Industry 5.0 – V-ONE to form an end-to-end AI-driven Inspection Ecosystem, guaranteeing seamless data connectivity and true closed-loop control. Ultimately, this comprehensive integration enables manufacturers to reduce human error, accurately detect defects early, optimize process performance, and maintain consistent product quality across every production stage.

Visit us at TaiNEX 2, 1F, Malaysia Pavilion, Booth to connect with our experts and discover tailored inspection solutions for your manufacturing needs. To schedule a meeting with our team during the exhibition, simply complete our appointment form or scan the QR code provided.

For further inquiries, please contact us at [email protected] or go to ViTrox.com. We look forward to meeting you in Taipei and embarking on an innovative journey together!

August 2026

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