06/15/2026
ROHM NEWS 📢
ROHM has developed the TSC3PAK package for SiC MOSFETs, designed to improve thermal performance and streamline manufacturing. With a top-side heat dissipation structure, it enables automated mounting while delivering heat dissipation comparable to traditional TO-247-4L through-hole packages.
This innovation supports higher efficiency and reliability in power conversion systems for onboard chargers and electric compressors in electric vehicles.
Learn more about how ROHM is advancing xEV performance👉 https://tinyurl.com/uuzjedrv