09/02/2026
SEMICON Taiwan 2026 is underway, and our team is on the floor at Booth J2834.
Every AI chip runs on data. So do we. That's the message we're bringing to Hall 1 this week, across three focus areas:
✔️ Fabless: Ship AI chips faster and surface risk before it escalates
✔️ Fabs & OSATs: See every wafer, predict every outcome
✔️ Equipment OEMs & Fabs: Connect and control every tool, secure every connection
Tomorrow morning, our own Kimon Michaels takes the stage at the Next Generation IC Design Summit to talk about designing intelligence and shaping the next era of semiconductor innovation.
If you're at the show, stop by Booth J2834. We'd like to show you what a real data backbone for the AI chip era looks like.