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PDF Solutions

Name: PDF Solutions
Address: 2858 De La Cruz Boulevard, Santa Clara, CA, 95050, US
Telephone: +1 408-280-7900

PDF Solutions is a leader in big data analytics solutions for semiconductor and electronics.

06/03/2026

We’re excited to introduce our new podcast series, “FinFET Local Layout Effects,” where we unpack what’s really driving semiconductor innovation in the post-scaling world—at the level of physics itself.

🎙️ Episode 1: How Transistor Neighborhoods Alter Device Physics

In this episode, we explore a fundamental shift in chip design: Layout is no longer just a blueprint—it changes how transistors behave.

As devices moved into 3D FinFET architectures, engineers gained control over electrostatics—but introduced a new challenge: mechanical stress at the nanoscale.

🔍 If you’re working in advanced nodes, device modeling, or chip architecture, this is a conversation you don’t want to miss.

🎧 Listen to Episode 1: https://go.pdf.com/l/814523/2026-06-02/cxmgq

06/01/2026

What is silicon really telling us?

This blog dives into the physics behind stress-related Local Layout Effects (LLEs)—and why features like diffusion breaks and gate cuts are quietly shaping device performance, leakage, and variability in ways traditional design assumptions can’t ignore.

What looks like randomness in silicon is actually predictable physics.

The key insight?

What may look like randomness in silicon is actually predictable, modelable behavior—when you understand the underlying physics.

That’s where advanced modeling and silicon-correlated analytics come in—turning complexity into actionable design and process insights.

👉 Read the full blog: https://go.pdf.com/l/814523/2026-05-26/cxbg1

05/29/2026

Is Agentic AI really a revolution in semiconductors… or the next step in a long evolution?

While it’s often framed as a breakthrough, today’s agentic AI builds on 30–40 years of progress in process control, data infrastructure, and system integration.

At PDF Solutions, we see this as momentum, not disruption. The real opportunity is leveraging decades of data and expertise to scale smarter, faster decisions.

The future isn’t about replacing legacy systems.
It’s about activating the intelligence already embedded within them.

👉 Read the full article "From Point Solutions to Agentic AI Ecosystems: Semiconductor Process Control Depends on Its Past" https://bit.ly/4d5xdmO

05/28/2026

🚀 We’re Hiring at PDF Solutions!

At PDF Solutions, we’re not just filling roles—we’re shaping the future of data and analytics across the semiconductor and electronics industry.
I’m excited to share that we’re looking for a Payroll Senior Analyst to join our team!

💡 About the role
As part of the Finance team, this position will the prepare/review, transmit and receive payroll data, taxes, and payroll deductions for a global company in a multi-cycle environment.

👉 Apply here and join our team! https://careers.pdf.com/careers-home/jobs/1546?lang=en-us

05/27/2026

As the semiconductor industry pushes toward “smart test,” it’s becoming clear: this is not just an AI or modeling challenge — it’s a data chain challenge.

In this Semiconductor Engineering article, Smart Test Collides With The Data Chain, an insight stands out:

“The greatest impact on value is the ability to collect, align, and normalize data, and then have the infrastructure to deploy the model wherever it would be useful,” said
Greg Prewitt, Director of Exensio Solutions at PDF Solutions. “That requires a lot of platform data engineering underneath, and traceability through all that.”

As devices move across wafer sort, package, system-level test, and even into the field, they generate massive, fragmented data streams.

The real challenge isn’t just building better models; it’s ensuring those models are powered by trusted, connected, and contextualized data across the entire lifecycle.

Read the full article here: https://semiengineering.com/smart-test-collides-with-the-data-chain/

05/25/2026

How sensitive is your layout—really?

As device geometries continue to shrink, layout-driven variability is no longer a secondary effect—it’s a primary driver of performance and yield.

In our latest blog, we break down the experimental methodology behind measuring layout sensitivity, with a focus on stress-related Local Layout Effects (LLEs).

👉 Read the full blog here: https://go.pdf.com/l/814523/2026-05-20/cx3dn

05/22/2026

AI in semiconductor manufacturing is splitting into two paths: point solutions vs. platform integration.

Point solutions deliver quick wins—but real impact comes from connecting data across the fab. When insights flow end-to-end, AI can move from isolated optimization to driving system-level performance.

At PDF Solutions, we believe the future is integrated: unified data, faster learning, and smarter decisions at scale.

It’s not just about using AI...it’s about deploying it the right way.

Read the SemiWiki.com article to learn more: https://semiwiki.com/artificial-intelligence/368629-two-paths-for-ai-in-semiconductor-manufacturing-platform-integration-vs-point-solutions/

05/20/2026

🔍 When Layout Becomes Device Physics

At advanced CMOS nodes, layout is no longer just about routing and density—it’s directly shaping device behavior. Stress‑related Layout‑Level Effects (LLEs) are now a critical contributor to performance variability, reliability risk, and yield loss.
In our latest blog, we explore why:

Mechanical stress from layout features alters transistor characteristics
Traditional corner‑based models fall short at advanced nodes
Accurate, physics‑informed modeling of stress‑related LLEs is essential for silicon predictability

📐 The takeaway? Design, process, and modeling must converge. Only by linking layout‑induced stress to compact models can teams close the gap between design intent and silicon reality.

👉 Read the full blog now: https://go.pdf.com/l/814523/2026-05-11/cwph4

05/19/2026

📢 We’re excited to share that Ming Zhang will be speaking at the GSA 2026 Tech Summit!

Ming will join industry leaders on a panel titled “Collaboration Models That Actually Work”, where the conversation will focus on practical, real-world approaches to collaboration that drive innovation and measurable results.

At PDF Solutions, collaboration across the semiconductor ecosystem is core to how we help customers accelerate yield, improve manufacturing performance, and scale advanced technologies. We’re looking forward to Ming sharing insights and lessons learned from working closely with partners across design, manufacturing, and data.

📍 GSA 2026 Tech Summit
🗓️ 1:40 PM
🎤 Panel: Collaboration Models That Actually Work

Learn more about the event here:

👉 https://www.gsaglobal.org/events/event/2026-tech-summit/

05/18/2026

At the 2025 PDF Solutions Users Conference, Ranjan Chatterjee took the stage to share a compelling vision for accelerating digital transformation in semiconductor manufacturing.

The presentation explored how manufacturers can move from systems of record to systems of action, leveraging real-time data, orchestration, and AI-enabled workflows. These workflows can improve product costing, yield, quality, and supply chain collaboration at scale and across complex global manufacturing networks.

If you missed the session or want to revisit the insights, the presentation is now available for download 👇

🔗 https://www.pdf.com/users-conference/2025-pdf-solutions-users-conference/accelerating-digital-transformation-download/

Thank you to everyone who joined us at the conference and contributed to the discussion on shaping the future of semiconductor manufacturing.

Address

2858 De La Cruz Boulevard
Santa Clara, CA
95050

Opening Hours

Monday	9am - 5pm
Tuesday	9am - 5pm
Wednesday	9am - 5pm
Thursday	9am - 5pm
Friday	9am - 5pm

Telephone

+1 408-280-7900

Website

http://www.pdf.com/

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