Amkor Technology, Inc.

09/01/2026

As performance demands continue to grow, innovation increasingly depends on how semiconductor devices are packaged and integrated.

Through advanced packaging, wafer-level processing and system-in-package solutions, Amkor Technology is advancing what's next across the communications, computing, automotive and industrial, and consumer markets that increasingly shape everyday life.

Learn more about Amkor Technology: https://amkor.com/

08/25/2026

Before returning to Arizona State University and San Jose State University for the fall semester, Amkor Technology interns had the opportunity to meet with members of our Executive Leadership Team and gain firsthand insight into leadership, business strategy and career development.

Kevin Engel, president and chief executive officer; Megan Faust, executive vice president and chief financial officer; Farshad Haghighi, executive vice president and chief sales officer; Detlef Nagel, corporate vice president, global operations; and Troy Philbert, corporate vice president and chief information officer, shared their career journeys and perspectives on leading a global semiconductor business.

The discussion gave interns the opportunity to ask questions, better understand Amkor's strategy and operations, and gain valuable perspective from leaders across the organization.

As summer ends and a new academic year begins, we thank our interns for their contributions and look forward to seeing what they accomplish both in the classroom and throughout their continued experience at Amkor.

Explore opportunities to learn, grow and make an impact at Amkor: https://bit.ly/4gkKhIa

08/20/2026

Amkor Technology was pleased to participate in the IMAPS Silicon Valley Chapter event, Accelerating Innovation in Advanced Packaging and Heterogeneous Integration with AI, hosted by Samsung Semiconductor.

Mike Kelly, vice president of Chiplets and Flip Chip BGA Packaging Development and Integration, contributed to the program through a presentation on power delivery in AI systems and the panel discussion, Scaling Advanced Packaging for the AI Era.

Thank you to IMAPS Silicon Valley Chapter and Samsung Semiconductor for convening leaders from across the semiconductor industry.

Learn more about Amkor's advanced packaging solutions: https://bit.ly/4wDGImw

08/19/2026

𝐂𝐚𝐧 𝐜𝐡𝐢𝐩𝐥𝐞𝐭𝐬 𝐬𝐜𝐚𝐥𝐞 𝐰𝐢𝐭𝐡𝐨𝐮𝐭 𝐜𝐫𝐞𝐚𝐭𝐢𝐧𝐠 𝐚 𝐭𝐞𝐬𝐭 𝐛𝐨𝐭𝐭𝐥𝐞𝐧𝐞𝐜𝐤?

As AI systems grow more complex, testing is becoming a critical challenge for advanced packaging. More die, tighter integration and greater system complexity demand test strategies that can scale alongside package architectures.

Vineet Pancholi, senior director, manufacturing test technologist at Amkor Technology, shares a perspective on why testability may become just as important as performance in next-generation designs.

Read the latest Semiconductor Engineering article by Anne Meixner: https://bit.ly/4qh5GXf

08/18/2026

The semiconductor industry generates more manufacturing data than ever before. The challenge isn't collecting that data. It's turning it into meaningful action.

As advanced packaging becomes increasingly complex, manufacturers need greater visibility across their operations to improve quality, optimize efficiency and make faster decisions.

That's where smart manufacturing comes in. By combining automation, AI and data-driven insights, manufacturers can create more connected operations and unlock new opportunities for continuous improvement.

At Amkor Technology, we're advancing Smart Manufacturing to help build more intelligent, agile and efficient manufacturing environments.

Learn how Amkor is building smarter, more connected manufacturing operations: https://bit.ly/3Zv3I8g

08/14/2026

Amkor is proud to join the Arizona Commerce Authority's economic delegation to the Republic of Korea, helping strengthen relationships that support semiconductor innovation, investment and supply chain resilience.

Learn how collaboration between Arizona and Korea is helping shape the future of the industry: https://bit.ly/4xE4OhG

08/06/2026

Understanding the semiconductor industry requires more than expertise in a single discipline. It requires seeing how technology, operations, finance and communications work together to move a business forward.

During a recent Lunch & Learn at Amkor Technology headquarters, interns heard from leaders across the organization, including Omer Dossani, vice president, Global Test Services; Wade Beckstead, senior manager, Operations Finance; Kris Pugsley, vice president, Marketing Communications; and Wayne Ga***rd, senior director, Creative.

Through their perspectives, interns gained a deeper understanding of how different functions contribute to Amkor's strategy, support customers and help drive innovation across the semiconductor ecosystem. The session provided more than an introduction to individual departments. It offered a broader view of how cross-functional collaboration turns ideas into outcomes and vision into ex*****on.

Investing in future talent means helping the next generation understand not only what we do, but how every part of the business contributes to long-term success.

Learn more about the career opportunities Amkor has to offer: https://bit.ly/4kPXOsg

08/05/2026

Missed our Q2 2026 earnings call? The replay is now available.

The semiconductor market is being shaped by growing demand for advanced computing and intelligent systems. In Q2 2026, Amkor Technology delivered record revenue of $1.9 billion, with Computing and Automotive & Industrial end markets contributing record results and helping drive strong profitability.

Watch the full earnings webcast for additional insights into our second-quarter performance, market trends and business outlook: https://bit.ly/4gGRqo1

08/04/2026

𝐂𝐚𝐧 𝐚 𝐩𝐚𝐜𝐤𝐚𝐠𝐞 𝐛𝐞 𝐜𝐨𝐧𝐬𝐢𝐝𝐞𝐫𝐞𝐝 "𝐟𝐥𝐚𝐭 𝐞𝐧𝐨𝐮𝐠𝐡" 𝐢𝐟 𝐢𝐭'𝐬 𝐨𝐧𝐥𝐲 𝐟𝐥𝐚𝐭 𝐚𝐭 𝐫𝐨𝐨𝐦 𝐭𝐞𝐦𝐩𝐞𝐫𝐚𝐭𝐮𝐫𝐞?

One growing industry debate is whether traditional flatness measurements still reflect real-world performance. Mike Kelly, vice president of Chiplets and Flip Chip BGA Integration at Amkor Technology, notes that future approaches may focus more on balancing stress and CTE effects across the package stack and optimizing for operating conditions rather than assembly conditions alone.

Read the latest Semiconductor Engineering article by Gregory Haley: https://bit.ly/4w1bMfG

As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.

07/30/2026

𝐓𝐡𝐞 𝐟𝐮𝐭𝐮𝐫𝐞 𝐨𝐟 𝐨𝐮𝐫 𝐢𝐧𝐝𝐮𝐬𝐭𝐫𝐲 𝐬𝐭𝐚𝐫𝐭𝐬 𝐰𝐢𝐭𝐡 𝐩𝐞𝐨𝐩𝐥𝐞.

This National Intern Day, we're celebrating the interns who spent the summer learning, growing and making an impact across Amkor Technology.

Through new experiences, meaningful projects and strong team connections, they gained skills that will help shape their careers while contributing to the work we do every day. Their curiosity, fresh perspectives and willingness to learn remind us that advancing what's next starts with investing in the next generation.

Thank you for everything you've brought to Amkor. We're excited to see where your journey takes you next.

Learn more about careers at Amkor Technology: https://bit.ly/4kPXOsg