Amkor Technology, Inc.

06/11/2026

Semiconductors are becoming more fundamental to everything we do, and that is changing where value is created in the supply chain. Kevin Engel, Amkor Technology, Inc.’s president and CEO, said the AI data center build-out is “going to be going on for years,” a reminder that advanced packaging is now central to performance, efficiency and supply resilience.

In his interview with Tiernan Ray in The Technology Letter, Kevin Engel pointed to Amkor’s $7 billion investment in a new Arizona facility as part of a broader shift toward regional diversity and closer-to-customer capacity. For the industry, the takeaway is clear: the next wave of growth will depend not just on chip design, but on the packaging and manufacturing infrastructure that brings increasingly complex devices to life.

Read the full interview: https://www.thetechnologyletter.com/the-posts/amkor-ceo-semiconductors-are-going-to-continue-to-thrive

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06/11/2026

As AI infrastructure continues to scale, co-packaged optics (CPO) is emerging as a critical technology for enabling higher bandwidth and improved energy efficiency in next-generation data centers. Realizing its full potential, however, requires overcoming significant testing and manufacturing challenges.

In a recent article by Anne Meixner for Semiconductor Engineering, Amkor's Vineet Pancholi, Senior Director of Test Technology, discusses the critical role of advanced test strategies, including device interface board (DIB) design, calibration, fixture architecture and the integration of optical and electrical instrumentation to enable scalable CPO production.

As Vineet notes, robust and manufacturing-ready test solutions will be essential to supporting the industry's transition from innovation to high-volume deployment.

Read Anne Meixner's full article to learn more about the opportunities and challenges shaping the future of co-packaged optics testing: https://semiengineering.com/co-packaged-optics-testing-faces-steep-data-center-ramp/

To discover how Amkor's advanced test solutions can help you with your next project, visit https://amkor.com/test

Scaling to tens of millions of CPO units per year requires the industry to first settle on automated, cost-effective methods for electrical and optical testing.

06/10/2026

In case you missed it, Amkor Technology, Inc.’s 2025 Corporate Responsibility Report highlights continued progress across our global responsibility and sustainability priorities.

Key areas include increased renewable energy usage and supplier engagement supporting our SBTi-aligned net-zero goal, TCFD-aligned climate disclosures with climate scenario analysis, and expanded focus on workforce, chemical management and smart factory initiatives. We also continue to prioritize health and safety, ethics and water reduction, alongside recognition for CDP double “A” scores and ISS Prime status.

This work reflects the collective efforts of our global teams, customers, suppliers and partners.

Explore the full report: https://bit.ly/4dTauwh

06/10/2026

Amkor Technology, Inc.'s Investor Day presentation is now available for download.

The presentation outlines our growth thesis through 2030, including plans to grow revenue to about $11 billion, lift gross margin to roughly 22% and deploy $7 billion in advanced packaging capacity in Arizona. It also details our technology roadmap, customer diversification strategy and the operational discipline that supports our long-term plan.

Download the Investor Day presentation:
https://bit.ly/4eyF7IA

Prefer to watch the full presentation? The replay of the Investor Day webcast is also available: https://bit.ly/4uOFK6i

06/09/2026

Amkor Technology, Inc. will participate in SEMI Advanced Packaging Summit 2026 in Suwon, South Korea, where Shinji Baba, vice president, R&D Center, Amkor Technology Japan, Inc., will present “𝘈𝘥𝘷𝘢𝘯𝘤𝘦𝘥 𝘗𝘰𝘸𝘦𝘳 𝘔𝘰𝘥𝘶𝘭𝘦 𝘗𝘢𝘤𝘬𝘢𝘨𝘪𝘯𝘨 𝘛𝘦𝘤𝘩𝘯𝘰𝘭𝘰𝘨𝘪𝘦𝘴.” The session will focus on recent trends in power devices and power module packaging, including electrical and thermal challenges, advanced interconnects, cooling architectures and embedded power modules.

The presentation will also frame the shift from digital to power devices, with a closer look at silicon, silicon carbide and gallium nitride applications. That matters now because the most important packaging challenges are no longer isolated to the device itself; they sit at the intersection of performance, cost and manufacturability, where advanced interconnects, cooling architectures and embedded power modules are becoming increasingly relevant.

🔍 Learn more about our advanced packaging: https://amkor.com/packaging/power-discrete/

06/09/2026

Building the semiconductor workforce starts earlier than hiring. It starts with giving educators a clear view of how the industry works and where students can fit into it.

On June 3 and 4, Amkor Technology, Inc. hosted its inaugural Semiconductor Educator Externship Bootcamp with the SEMI Foundation, TechSmart Learning Fund and West-MEC. Over two days, educators explored the semiconductor ecosystem from wafer fabrication to advanced packaging, then brought that learning to life through a cleanroom simulation.

The goal was practical: help educators return to their classrooms with the context, tools and technical understanding to make semiconductor careers more visible to students. As advanced packaging becomes more central to the industry, that kind of workforce education matters.

Thank you to our partners Advanced Technologies Consultants, Inc. and ROOTS Education Co. for the immersive cleanroom experience and leadership, and to Azra Baab, manager of university relations and workforce development, and Kelly Zavagnin, director of learning and development, for representing Amkor at this event. Programs like this create impact that reaches far beyond two days and into future classrooms, career pathways and communities.

Learn more about career opportunities at Amkor: amkor.com/careers

06/04/2026

Amkor Technology made a strong impact at ECTC 2026, connecting with more than 2,700 attendees, including a large community of students and future industry talent. The winner of our raffle giveaway at the Amkor booth was Dr. Nia Richards of KLA, helping add excitement and engagement to our presence on the show floor.

Our newly enhanced booth drew steady traffic throughout the event, showcasing Amkor’s advanced packaging leadership and creating meaningful conversations around career opportunities, especially at our upcoming Amkor Technology Arizona (ATA) facility in Peoria. We also strengthened key supplier relationships through productive discussions and collaboration opportunities.

Top of mind for attendees were ATA’s progress, workforce development and future packaging and test capabilities. We also saw strong engagement with advanced technologies, including Amkor's S-Connect™ and S-SWIFT™ technology, and co-packaged optics, wafer-level solutions, advanced test services, quantum computing and memory. Our collaborations with AMD, Apple, Taiwan Semiconductor Manufacturing Company and NVIDIA further reinforced our role in enabling next-generation innovation. Our package displays were a clear highlight, sparking technical discussions across the show floor.

Our technical leadership was on full display. JongMin Park’s poster on glass core substrates for and drew significant attention and strong engagement from attendees. Suresh Jayaraman and KyungRok Park helped drive deeper discussions onsite.

At our sponsored luncheon, Kris Pugsley’s presentation on scaling global capabilities to U.S. manufacturing resonated with a full, highly engaged audience, spotlighting Amkor’s expanding U.S. presence.

A great team effort all around, strengthening our brand, showcasing innovation and deepening connections across the ecosystem.

We look forward to seeing you at ECTC 2027 in Denver! https://ectc.net

06/04/2026

Amkor Technology, Inc. is honored to be recognized by the Arizona Chamber Foundation as a 2026 Top Newsmaker Award honoree. 🏆

The recognition reflects more than a major investment in our Peoria campus. It reflects the growing importance of advanced packaging in a semiconductor supply chain that is increasingly central to AI, HPC, automotive and other critical industries.

We’re grateful to the The Arizona Chamber of Commerce & Industry, the Greater Phoenix Chamber Foundation and the City of Peoria, Arizona Government for their partnership and support. We also congratulate the City of Peoria on being named the 2026 Best City for Business. 👏

As Mark Rogers, Amkor’s EVP, General Counsel and Corporate Secretary, noted in accepting the award, this project is a testament to Amkor’s deep roots in Arizona and our commitment to U.S.-based advanced manufacturing and supply chain resiliency.

Learn more about Amkor Technology Arizona: amkor.com/amkor-technology-arizona

06/03/2026

Amkor Technology, Inc.'s latest Arizona land acquisition signals something bigger than site growth as advanced packaging moves from a capacity question to an industrial strategy. As demand for HPC accelerates, proximity, scale and packaging capability are becoming part of the competitive advantage.

That is why our work with AMD matters. It reflects the shift underway across the semiconductor ecosystem where customers need packaging partners that can support more complex integration, tighter supply chains and long-term manufacturing plans.

Amkor’s role is to help make that transition real with the operational depth and technical capability needed to support next-generation systems in Arizona and beyond. The direction is clear: advanced packaging is becoming foundational to how the industry builds for AI and other compute-intensive applications.

Read the full Reuters article by Stephen Nellis: https://www.reuters.com/world/asia-pacific/amkor-working-with-amd-advanced-packaging-after-acquiring-more-land-arizona-2026-05-21/

Amkor Technology is working with Advanced Micro Devices on packaging AMD's chips, Amkor said ​on Thursday.

06/02/2026

We’re proud to share that Amkor Technology, Inc. has been recognized on the Compute 100 list, highlighting the most innovative companies driving the future of computing.

As advanced computing continues to evolve, from AI and high-performance computing to next-generation data centers, advanced packaging and test solutions play a critical role in enabling performance, efficiency and scalability. At , we’re committed to delivering the technologies that power these breakthroughs and help our customers bring innovation to market faster.

This recognition reflects the strength of our global team, our deep customer partnerships and our focus on enabling the next wave of semiconductor innovation.

Learn more about how Amkor is supporting the future of computing at https://www.amkor.com